Application Case of IGBT Liquid Cooling

With the advancement of semiconductor technology and manufacturing processes, semiconductor devices are progressively evolving toward higher performance, cost efficiency, and miniaturization. However, this progress has led to a significant increase in heat generation. If the cooling system (e.g., heat sinks) fails to dissipate this heat effectively, the equipment will operate under prolonged high-temperature conditions, drastically increasing the failure and malfunction rates of power semiconductor devices.

Traditional air cooling struggles to meet the heat dissipation demands of high-power, high-heat-flux-density transmission systems. As a result, liquid cooling—a more efficient thermal management solution—has emerged. Liquid cooling utilizes circulating coolant within flow channels and employs multiple cold plates to absorb and dissipate heat through convective heat transfer. This technology offers advantages such as high specific heat capacity, excellent heat transfer coefficient, rapid cooling efficiency, uniform temperature distribution, compact structure, and minimal thermal gradients. In recent years, liquid cooling has been widely adopted for thermal management in high-power semiconductor devices.