Custom Liquid Cold Plates RFQ (GPU/CPU) — Send Drawings for a Fast Engineering Review

Coming from our data center cold plate reference page?
If you’re targeting GPU/CPU direct-to-chip liquid cooling, you can review our reference assemblies first:
Data Center Cold Plates (GPU/CPU) → data-center-cold-plates

When you’re ready, share your interface drawing + boundary conditions and we’ll respond with a manufacturable quotation and build plan.

Looking for data center GPU/CPU cold plates? See reference assemblies

If you’re validating or scaling a direct-to-chip liquid cooling loop, the cold plate must meet your real coolant and ΔP constraints.
Share your interface drawing and boundary conditions — we’ll return a manufacturable concept and quotation.

MOQ: 5 pcs (prototype)
Prototype lead time: 4–6 weeks (depending on complexity & validation scope)
Engineering response: 1–3 business days (with complete inputs)

Fastest contact:
WhatsApp: +61 449 963 668
Email: sales@tonecooling.com

Data center GPU/CPU liquid cold plate reference assemblies (GB200, H200, AMD SP5, Birch Stream) — Reference cold plate assemblies for direct-to-chip liquid cooling on data center GPU/CPU platforms: GB200, H200, AMD EPYC SP5, Birch Stream.

What you’ll get from us (what procurement & engineers care about)

Once inputs are complete, we typically provide:

A manufacturable cold plate concept (channeling/porting approach aligned to your ΔP and thermal targets)
DFM notes and risk flags (flatness/warpage, joining selection, tolerance stack-ups)
Lead time and commercial quotation (prototype scope; production path discussion if needed)
A clear next-step validation plan (what to test first, what to lock before ramp)

What we need for a fast, accurate quote (RFQ package)

Please send the following (copy/paste friendly):

A) Mechanical interface (required)

STEP/STP (preferred) or PDF drawing
Mounting pattern, keep-out zones, stack-up / envelope limits
Contact area definition (cold plate footprint vs IHS/heat spreader)

B) Thermal boundary (required)

Total TDP (W) and hotspot / heat map (if available)
Target surface temperature (or allowable junction proxy)
Inlet temperature range / operating conditions

C) Coolant & loop constraints (required)

Coolant type: DI water / EGW / PGW (concentration if applicable)
Target flow rate (L/min)
Allowed pressure drop ΔP limit (kPa) at target flow

D) Integration details (highly recommended)

Port location constraints & orientation
Fitting requirements (thread spec / quick disconnect model / hose size)
Manifold or direct hose routing preference

E) Commercial basics (required)

Prototype quantity + expected annual volume (if known)
Timeline (target sample date / pilot / ramp)

Supported file formats: STEP/STP, PDF, DWG/DXF, ZIP (for multiple files)

Capabilities (kept practical)

Direct-to-chip cold plates for data center GPU/CPU platforms and high-power electronics
Materials: copper / aluminum (selected based on coolant, corrosion strategy, cost)
Joining options (project-based): brazing / diffusion welding / laser welding
Integration support: ports, manifolds, hose routing, serviceability considerations

Verification options (project-based, aligned to your spec)

Common verification requests include:

Leak-tightness verification (method & acceptance per your requirement)
Pressure capability / proof testing logic (per system spec)
Flow & ΔP verification under defined coolant viscosity
Thermal checks under defined inlet temperature and flow

If you already have CTQs / acceptance criteria, send them early — it prevents redesign loops.

How to send (fastest way)

Email: sales@tonecooling.com
WhatsApp: +61 449 963 668

Confidentiality / NDA

Information shared is used only for evaluation and quotation purposes. NDA support is available upon request.

FAQ

Q1: What’s the minimum information needed to start?
A: Interface drawing (STEP/PDF) + TDP/heat map + coolant & inlet temp + flow + ΔP limit.

Q2: What is the MOQ for prototypes?
A: Typical MOQ is 5 pcs.

Q3: What is the prototype lead time?
A: Typically 4–6 weeks, depending on complexity and validation scope.

Q4: How fast do you respond after receiving complete inputs?
A: Typically 1–3 business days with a manufacturable proposal, lead time, and quotation.

Q5: Can you design to a strict ΔP budget?
A: Yes. ΔP is treated as a primary design constraint; channels and porting are tuned to balance thermal performance and hydraulic limits.

Q6: Which coolants do you support?
A: DI water, EGW, and PGW mixtures are common. Material selection and corrosion strategy should match your coolant and temperature class.

Q7: Can you support quick disconnects and manifold integration?
A: Yes. We can build to your fitting standard and routing constraints.

Q: Do you have reference builds?

External References

Trademark Notice

NVIDIA and AMD are trademarks of their respective owners. Our solutions may be compatible with certain platforms, but we are not affiliated with or endorsed by NVIDIA/AMD.

Cold Plate RFQ | Custom Liquid Cold Plates (GPU/CPU) | ToneCooling