LGA4189 CPU Cooler For High-Power Servers

Efficient TC-LGA4189 CPU Cooler For High-Power Servers

The TC-LGA4189 CPU cooler is specifically designed for Intel Xeon processors, providing exceptional cooling performance for high-power applications. With a robust build and optimized design, this cooler is ideal for server environments that require reliable thermal management.

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Key Features

Quad 8mm copper heat pipes with nickel-plated anti-oxidation coating
High-static-pressure 120mm PWM fan (30-55 dB(A), 2000-5000 RPM)
Universal mounting for TC-LGA4189 sockets in 1U/2U/4U chassis
Intelligent thermal throttling via IPMI 2.0 integration
150,000-hour MTBF with dual-ball bearing fan

Key Features and Specifications:

CPU Socket Compatibility: TC-LGA4189, suitable for Intel’s latest Xeon processors.
Product Dimensions: 350mm * 200mm * 25mm, making it suitable for various server chassis configurations.
Power Consumption: Capable of handling up to 400W TDP, ensuring efficient cooling for high-performance CPUs.
Fin Thickness: 0.15mm, allowing for increased surface area and improved heat dissipation.
Fin Spacing: 0.15mm, optimizing airflow through the cooler.
Material Composition: Constructed with a copper base, aluminum fins, and four heat pipes to enhance thermal conductivity and heat transfer.

Engineered to tackle extreme thermal demands, the Efficient LGA4189 CPU Cooler is purpose-built for high-power server environments where reliability and performance are paramount. Its advanced cooling architecture caters to the following mission-critical applications:

Enterprise Data Centers & Hyperscale Cloud
Supports Intel Xeon Scalable processors in virtualized and containerized workloads, enabling uninterrupted operation of high-TDP CPUs (up to 350W) in densely packed server racks. Ideal for VMware, OpenStack, and Kubernetes clusters requiring 24/7 thermal stability.
AI/ML Training & Deep Learning
Sustains peak performance for GPU-accelerated AI training servers, preventing thermal throttling during large-scale model training. Optimized for NVIDIA DGX systems and TensorFlow/PyTorch workloads in AI labs and research facilities.
High-Performance Computing (HPC)
Cools CPUs in supercomputing clusters handling computational fluid dynamics (CFD), climate modeling, and genomic sequencing. Its direct-contact heat pipes and vapor chamber design minimize thermal resistance for sustained multi-threaded workloads.
Financial High-Frequency Trading (HFT)
Ensures ultra-low latency for algorithmic trading servers by maintaining consistent CPU clock speeds under 100% utilization. Corrosion-resistant construction withstands data center humidity fluctuations.

Cooling Performance:

This cooler is engineered to provide optimal cooling efficiency, making it suitable for demanding server applications. The combination of copper and aluminum materials ensures effective heat dissipation, while the four heat pipes facilitate rapid heat transfer away from the CPU.

Considerations for Use:

Server Form Factor: Designed to fit within standard server chassis, making it versatile for different setups.
Airflow Requirements: Ensure adequate airflow in the server environment to maximize the cooler’s efficiency.
Noise Levels: While designed for high performance, consider fan options that balance cooling with noise levels in sensitive environments.

In summary, the TC-LGA4189 CPU cooler is an excellent choice for users seeking reliable cooling solutions for high-power Intel Xeon processors. Its efficient design and robust construction make it a valuable component in any server setup requiring optimal thermal management.

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