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Integrated Heat Dissipation Modules
Optimize High Power Chip Performance with Integrated Heat Dissipation Modules
Heat Dissipation Modules
Integrated Heat Dissipation Modules
Optimize High Power Chip Performance with Integrated Heat Dissipation Modules
Heat Dissipation Modules

Optimize High Power Chip Performance with Integrated Heat Dissipation Modules

  • AIO(All-In-One) structure is more suitable for modular management of server.
  • Non-tube means leakage risk considerably reduces and the less evapotranspiration to be a long life.
  • NLP  (Non-Leaking Point) Tech: Few manual assembled and mature brazing process guarantees zero leakage.
  • Liquid cooling solution for compact server case.
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Optimize High Power Chip Performance with Integrated Heat Dissipation Modules Description

1. Efficient Heat Transfer: These modules use advanced materials and designs to effectively dissipate heat from high-power chips, ensuring stable and efficient operation

2. Compact Design: The modules are designed to be compact, making them suitable for integration into various electronic devices without adding significant bulk

3. Enhanced Reliability: By maintaining optimal temperatures, these modules help extend the lifespan of electronic components and reduce the risk of thermal-related failures

4. Low Maintenance: The integrated design minimizes the need for regular maintenance, providing a hassle-free cooling solution

5. Noise Reduction: These modules often incorporate silent operation features, making them ideal for noise-sensitive environments

6. Scalability: They can be used in a wide range of applications, from consumer electronics to industrial machinery, due to their versatile design

Optimize High Power Chip Performance with Integrated Heat Dissipation Modules Data Sheet

Pump Model A2
Voltage 12V
Speed 4000RPM
Radiator Dimensions 317.5×108.5×32.3mm
Material Aluminum
Fan Dimensions 100x100x15m
Voltage 12V
Speed 3000RPM
Air flow(max) 90.5CFM
Prerssure(max) 2.1mm/H2O
Noise 55dBA
Quantity 3Pcs

Optimize High Power Chip Performance with Integrated Heat Dissipation Modules Applications

1. Power Electronics: These modules are essential in power electronics applications, where they help manage the significant heat output from high-power devices, ensuring stable and efficient operation

2. Data Centers: In data centers, they maintain optimal temperatures for servers and other critical infrastructure, reducing the risk of overheating and improving energy efficiency

3. Consumer Electronics: Integrated heat dissipation modules are used in devices like smartphones, laptops, and gaming consoles to keep them cool and enhance their performance and longevity

4. Automotive Industry: These modules are crucial in electric vehicles and other automotive applications, where they help manage the heat generated by high-power electronic components

5. Industrial Applications: In industrial settings, they provide reliable cooling for machinery and electronic components, enhancing their durability and performance in harsh environments

Integrated Heat Dissipation Modules are engineered to optimize the performance of high-power chips by efficiently dissipating heat. These compact and reliable modules use advanced materials and designs to ensure stable operation and extend the lifespan of electronic components. Ideal for applications in power electronics, data centers, consumer electronics, automotive industry, and industrial settings, they provide a low-maintenance and noise-reducing cooling solution that enhances the durability and performance of high-power devices.

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