Opened-Loop Liquid Cooling Modules
Opened-Loop Liquid Cooling | Maximize Data Center Uptime
- Adopt all-aluminum brazing process to ensure no leakage.
- Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces.
- Few manual assembled and greatly reduce the evapotranspiration rate.
- It is mainly used for server/Data center (it can meet 4677, 4189, 3647, TR4 and other standard platforms, and can be customized for non-standard platforms)
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Maximize Data Center Uptime with Opened-Loop Liquid Cooling Modules Description
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Customizable Cooling Solutions:
• Modular Components: Users can select and assemble components such as pumps, radiators, CPU blocks, and reservoirs to create a tailored cooling solution that meets specific thermal requirements
• Scalability: Easily expandable to accommodate additional cooling needs as data center demands grow
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Efficient Heat Dissipation:
• High-Performance Radiators: Designed to effectively dissipate heat from the coolant, ensuring optimal cooling performance
• Direct-to-Chip Cooling: Utilizes cold plates placed directly on CPUs and GPUs to maximize heat transfer and cooling efficiency
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Enhanced Reliability:
• Redundant Components: Incorporates redundant pumps and other critical components to ensure continuous operation and minimize downtime
• Leak Detection Systems: Advanced leak detection mechanisms to prevent coolant leaks and protect sensitive equipment
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Ease of Maintenance:
• Hot-Swappable Parts: Allows for easy maintenance and replacement of components without shutting down the system
• Accessible Design: Simplifies installation and maintenance with easily accessible components
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Energy Efficiency:
• Optimized Power Consumption: Designed to reduce overall power consumption by efficiently managing heat, contributing to lower energy costs
Maximize Data Center Uptime with Opened-Loop Liquid Cooling Modules Data Sheet
| Waterblock | Dimensions | Base | Principalpart |
| 156*78*25.5mm | Aluminum | Aluminum | |
| Tube | Dimensions | Material | |
| Φ11mm | EPDM |
Maximize Data Center Uptime with Opened-Loop Liquid Cooling Modules Applications
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Data Centers:
• High-Density Server Racks: Ideal for cooling high-density server racks, ensuring optimal performance and energy efficiency
• Hyperscale Data Centers: Used in large-scale data centers to manage the heat generated by thousands of servers
2.
High-Performance Computing (HPC):
• Supercomputers: Essential for cooling supercomputers that perform complex calculations and simulations
• Research Institutions: Used in academic and research institutions for scientific computing and data analysis
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Enterprise Servers:
• Mission-Critical Applications: Ensures reliable cooling for enterprise servers running mission-critical applications, reducing the risk of downtime
• Financial Services: Used in financial institutions to maintain the performance of servers handling large volumes of transactions
4.
Telecommunications:
• Network Operations Centers (NOCs): Helps in cooling servers and networking equipment in NOCs, ensuring uninterrupted communication services
• 5G Infrastructure: Supports the cooling needs of servers and equipment used in 5G networks
5.
Industrial Applications:
• Manufacturing: Used in industrial environments to cool servers and control systems in manufacturing processes
• Energy Sector: Helps in cooling servers used in energy management and smart grid applications
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