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CPU GPU Liquid cold plates
cpu cold plate
CPU GPU Liquid cold plates
cpu cold plate

T-HS202306-NVIDIA GPU A6000 single-width liquid cooling plate

·High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation.
·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs.
·Precision Machining: Designed with high precision to ensure optimal contact and cooling performance.
·Durable Materials: Made from materials like copper or aluminum with anti-corrosion coatings for long-lasting use.
·Compact and Lightweight: Designed to fit within tight spaces while minimizing additional weight.
·Enhanced Cooling Efficiency: Features advanced flow channel designs to maximize heat removal and maintain stable operating temperatures.

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CPU GPU Liquid cold plates Technical/Data Sheet

Model Category
T-HS202306 NVIDIA GPU
Welding process heat source Total power
pure copper TLP welding 300W
Working environment cold plate surface temperature
50°C,1LPM,34%EGW below62°C
flow resistance Resistant to stress
Below2.5KPa 1Mpa

1.Computer Applications 2.Data Center Applications 3.Server Applications 4.Gaming PC Applications

1.CPU and GPU liquid cold plates are essential in high-performance computing, gaming PCs, data centers, and servers, ensuring efficient cooling for optimal performance and reliability
2.CPU and GPU liquid cold plates are crucial in data centers for managing heat, enhancing cooling efficiency, and maintaining optimal performance and reliability of high-density servers.
3.CPU and GPU liquid cold plates optimize cooling in servers, improving heat dissipation, maintaining performance, and extending the lifespan of high-performance computing components.
4.CPU and GPU liquid cold plates enhance cooling in gaming PCs, boosting performance, reducing overheating, and enabling higher overclocking for smoother gameplay and improved system stability.

CPU GPU Liquid cold plates

NVIDIA GPU A6000 single-width liquid cooling plate

The unique heat dissipation design cleverly directs the water cooling liquid to

the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and

heat dissipation performance. Its unique flow path design ensures that the

coolant can flow efficiently.Evenly distributed on each heat dissipation surface,

thereby significantly improving heat dissipation efficiency. Compared with

traditional heat dissipation methods.Heat sinks and fans enhance heat

dissipation more effectively.

Small batch customization with quick proofing

》Efficient heat dissipation, coolant flow rate, and space utilization.

》Heat dissipation structure design and circulation system design.

》Drilling, welding, surface treatment and other processes.

》Using heat pipe technology and sealing materials.

》Can be customized according to customer conditions.

Advanced Liquid Cooling Plate Solutions for High-Thermal-Load Environments

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