TC-4677-1UM71-P CPU Cooler: Ultra-Low Profile Cooling for LGA4677 1U Server Platforms

The TC-4677-1UM71-P CPU cooler is an ultra-low-profile thermal solution designed for Intel’s LGA4677 socket, supporting 4th and 5th Gen Xeon Scalable processors (Sapphire Rapids / Emerald Rapids). Engineered for high-density 1U server applications with strict space and airflow constraints, it ensures stable operation under up to 300W TDP, making it ideal for enterprise, AI inference, edge computing, and telco applications.

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Mechanical Design & Installation

Dimensions: 94mm × 94mm × 39.5mm (H)
Tool-free installation brackets compatible with Intel reference mounting
Robust and durable structure for rackmount environments

Materials:

Base: Pure copper (C1100)
Heatpipes: Copper, sintered wick
Fins: Aluminum
Weight: ~490g
Connector: 4-pin PWM

TC-4677-1UM71-P Technical

Product model: TC-4677-1UM71-P

CPU type: TC-LGA4677 (rectangular motherboard)

Product size: 118mm*78mm*25.3mm

Power consumption: 185W

Fin thickness: 0.3mm

Fin spacing: 1.5mm

Material: copper base + aluminum fins + 4 heat pipes

Key Features & Innovations

A. Ultra-Low Profile Design

Overall height: 39.5mm, including fan
Perfect fit for compact 1U chassis with tight clearance
Maintains thermal headroom even in airflow-restricted systems

B. Full Copper Core with Direct Contact

High-purity C1100 copper base ensures rapid thermal transfer from CPU IHS
Machined for flatness with pre-applied phase-change thermal interface material (TIM) for quick installation

C. 6-Pipe Heat Dissipation Array

Integrated 6 × Ø6mm copper heatpipes
High-efficiency sintered wick structure for consistent liquid return
Flat-pipe configuration maintains height compliance without sacrificing cooling capacity

D. Advanced Fin Array Construction

Densely stacked aluminum fins designed to enhance thermal dissipation under forced airflow
Optimized fin spacing for minimal flow resistance in 1U pressure zones
Vacuum-soldered bonding between heatpipes and fin array for ultra-low thermal resistance

Target Use Cases

High-Density Compute Nodes

Ideal for server farms and co-location facilities with tight thermal budgets
Optimized to prevent CPU thermal throttling under sustained loads

Edge Computing & AI Inference

Delivers reliable performance in constrained installations and remote edge sites
Maintains thermal consistency in high-performance inference workloads

5G Telco Infrastructure

Compact, quiet, and vibration-resistant for MEC, core, and distributed units
Compatible with NEBS and telecom environmental standards

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