ToneCooling TC-4677-2UM87 CPU Cooler thermal management

ToneCooling 2UM87 CPU Cooler thermal management

TC-4677-2UM87 CPU Cooler: High-Performance 2U Thermal Solution for Intel Xeon Gen 4/5

The TC-4677-2UM87 CPU Cooler is purpose-built for Intel’s LGA4677 socket, supporting 4th and 5th Gen Xeon Scalable Processors (Sapphire Rapids & Emerald Rapids). Engineered to handle extreme compute loads in 2U rackmount systems, this cooler combines premium thermal components, smart airflow design, and superior reliability — making it ideal for AI servers, cloud infrastructure, HPC clusters, and edge compute nodes.

Get A Free Quote

Products Categories

Heat Sink

Tubed Cold Plates

CPU GPU Cold Plate

Vapor Chamber

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

Temperature plate VC

Coolserver

TC-BGA 2518

TC-LGA 7529

TC-LGA 9324

TC-LGA 4189

TC-LGA 4677/4710

TC-LGA 1700/1851

LGA 3647 Narrow

TC-LGA 3647 Square

TC-LGA 2011 Narrow

TC-LGA 2066/2011 Square

TC-LGA 115X/1200

AMD SP7 Series

AMD SP6 Series

AMD SP5 Series

AMD SP3 Series

AMD AM5 Series

AMD AM4 Series

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

AIO COOLER RADIATOR

CPU Cold Plate

GPU Cold Plate

IGBT cold plate

MOS Cold Plate

Battery Cold Plate

Key Features

A. Extreme Cooling Capacity

Supports up to 385W TDP CPUs in continuous full-load scenarios
Keeps CPU temperatures below 68°C under stress loads in 2U environments
Designed for long-term 24/7 uptime in mission-critical deployments

B. Pure Copper Cold Plate + Heatpipe Array

Large C1100-grade copper base enables rapid heat absorption from CPU die
8× Ø6mm sintered heatpipes arranged in a U-shaped configuration for balanced thermal distribution
Vacuum soldering ensures minimal thermal resistance and long-term mechanical stability

C. Dense Dual Fin Stack for Maximum Dissipation

Dual-tower design with high-density aluminum fins
Optimized fin pitch to enhance airflow turbulence and increase surface area
Optional black anodization available for anti-oxidation and improved aesthetics

TC-4677-2UM87 Technical

Product model: TC-4677-2UM87
CPU type: TC-LGA4677
Voltage: 12V
Product size: 118mm*79mm*64.5mm
Fan speed: PWM 3000-11000RPM
Noise value: 52.50dBA (MAX)
Air volume: 47.20CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball bearing
Power consumption: 385W
Material: copper base + aluminum fins + 5 heat pipes

Application Scenarios

AI & Machine Learning

Enables thermal headroom for large-model training tasks on CPU-heavy architectures
Compatible with mixed CPU-GPU systems, preventing airflow collision

Cloud & Virtualized Infrastructure

Stable cooling performance in containerized and virtual machine environments
Supports high-density rack deployments with minimal thermal throttling

Telecom Edge Nodes

Ready for 5G base stations and MEC servers in thermally constrained locations
Withstands environmental challenges like wide ambient temperature and vibration

Conclusion: Reliable Cooling for Mission-Critical Intel Xeon Platforms

The TC-4677-2UM87 delivers robust, scalable thermal performance optimized for modern 2U Intel Xeon server platforms. Its efficient heatpipe system, dual-fan cooling, and compact yet powerful architecture make it a top choice for next-gen AI, cloud, and HPC systems that demand stable, high-output thermal control.