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ToneCooling TC-LGA2011-1U1C CPU Cooler thermal management
ToneCooling LGA2011-1U1C CPU Cooler thermal management
ToneCooling TC-LGA2011-1U1C CPU Cooler thermal management
ToneCooling LGA2011-1U1C CPU Cooler thermal management

TC-LGA2011-1U1C CPU Cooler: Compact and Efficient Cooling for 1U Intel® Xeon® Servers

The TC-LGA2011-1U1C CPU Cooler is a high-efficiency thermal solution designed specifically for Intel® Xeon® processors using the LGA 2011 socket in 1U rackmount server systems. Engineered with a compact profile and optimized airflow, this cooler is ideal for high-density server deployments where space is limited but reliable thermal performance is critical. It balances size, performance, and noise control to ensure stable operation in continuous, heavy-load environments.

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Key Features

  • Intel LGA 2011 Compatibility
    Tailored to support Intel® Xeon® processors such as the E5 series, ensuring a secure fit and optimal heat transfer for enterprise-grade applications.

  • Low-Profile 1U Design
    Built for space-constrained 1U rackmount chassis, the cooler maintains a compact footprint while delivering solid cooling performance—ideal for dense server racks.

  • Direct-Contact Copper Base
    The copper base plate ensures efficient heat conduction from the CPU to the aluminum heatsink fins, promoting fast and even thermal dissipation.

  • High-Speed PWM Fan
    Equipped with a 40mm high-speed fan featuring PWM (Pulse Width Modulation) for dynamic speed control based on temperature, enhancing cooling while minimizing noise and power consumption.

  • Reliable and Secure Mounting
    Designed for quick installation and firm CPU contact, ensuring stability during 24/7 server operation.

TC-LGA2011-1U1C Technical

  • TC-LGA2011-1U1C radiator (for 1U servers)
  • Product model: TC-LGA2011-1U1C
  • CPU type: TC-LGA2011 (square motherboard)
  • Voltage: 12V
  • Product size: 88mm*88mm*23mm
  • CPU hole distance: 80mm*80mm
  • Fin thickness: 0.35mm
  • Fin spacing: 1.9mm
  • Power consumption: 100W
  • Material: copper base + copper fins

Application Fields

1. 1U Rackmount Servers

Perfect for enterprise-grade 1U servers operating in data centers or server farms. It provides the necessary thermal performance to keep Intel Xeon processors running reliably under continuous, high-demand workloads.

2. Cloud and Virtualization Platforms

Essential for servers powering cloud applications and virtual machines, where hardware density and thermal management are key. The 1U1C cooler helps maintain system stability in tightly packed server racks.

3. High-Density Computing Environments

Used in scenarios where multiple 1U servers operate side by side, such as edge computing, co-location facilities, or micro data centers. Its low profile and efficient cooling help optimize thermal conditions in compact environments.

4. Web Hosting and CDN Infrastructure

Ideal for lightweight server tasks like web hosting, DNS management, and content delivery networks (CDNs), where many servers work together at moderate loads but must remain cool and quiet.

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

Need a Custom Liquid Cold Plate?

Tell us your thermal requirements. Engineering team responds within 48 hours with design proposal and quotation.

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MOQ 5 pcs • Prototype 7-15 days • ISO 9001 Certified

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