A AI server liquid cooling solutions is a precision thermal management component that removes heat from high-power electronic devices by circulating liquid coolant through internal channels, achieving 10-25x better heat transfer than air cooling.
Years Experience
Certified Factory
Pieces Minimum
Days Prototype
Leak Tested
As AI computing density reaches unprecedented levels, conventional air cooling can no longer meet the thermal demands of modern GPU and CPU clusters. ToneCooling provides purpose-built AI server liquid cooling solutions for hyperscale data centers, HPC facilities, and enterprise AI infrastructure — delivering direct-to-chip cold plates engineered for NVIDIA GB200, GB300, H200, and AMD SP5 platforms.
Our liquid cold plates are designed for high heat flux environments where reliability, flow efficiency, and mechanical precision are non-negotiable.
Why AI Servers Require Liquid Cooling
Modern AI accelerators generate 300–1,000W+ per chip. Air cooling systems cannot dissipate this heat density without compromising server density, acoustic performance, and PUE targets.
Liquid cooling solves this by:
- Transferring heat directly from the chip surface via a thermally optimized cold plate
- Achieving cooling capacities of 500W–2,000W+ per module
- Maintaining junction temperatures within safe operating limits even under sustained full-load inference or training workloads
- Enabling high-density rack configurations (80kW–120kW+ per rack) that air cooling cannot support
ToneCooling’s direct-to-chip cold plates are the thermal foundation for next-generation AI server deployments.
Products: Liquid Cold Plates for AI Accelerators
NVIDIA GB200 Liquid Cold Plate
Engineered for the NVIDIA GB200 Grace Blackwell Superchip, our GB200 cold plate delivers precision thermal contact across the full die footprint. Supports both single-module and NVL72 rack-scale configurations.
- Thermal capacity: up to 1,200W per module
- Material: Oxygen-free copper with vacuum-brazed micro-channel structure
- Interface: Compatible with CDU loop and direct facility water systems
- MOQ: 5 pcs | Prototype lead time: 7–15 days
NVIDIA GB300 Liquid Cold Plate
The GB300 platform increases TDP beyond GB200. ToneCooling’s GB300 cold plate is designed with an upgraded micro-channel density to handle the increased heat flux without increasing cold plate footprint.
- Optimized for GB300 NVL72 and GB300 Ultra configurations
- Leak-tested to 10 bar; working pressure rated at 5 bar
- Custom manifold integration available
NVIDIA H200 Liquid Cold Plate
For existing H200 SXM5 deployments, our cold plate retrofit solution enables data centers to transition from air to liquid cooling with minimal infrastructure changes.
- Drop-in compatible with H200 SXM5 socket geometry
- Copper or aluminum alloy options available
- Tested to ASHRAE W55 water quality standards
AMD EPYC SP5 (Genoa / Bergamo) CPU Cold Plate
AI inference workloads increasingly rely on high-core-count EPYC processors alongside GPU accelerators. Our SP5 cold plate is sized for dual-socket server configurations and optimized for low coolant pressure drop.
- Socket coverage: SP5 (Genoa, Bergamo, Siena)
- Pressure drop: <15 kPa at 2 L/min flow rate
- Compatible with standard 1U and 2U server chassis cold plate mounting patterns
ToneCooling Manufacturing Capabilities
ToneCooling operates a vertically integrated manufacturing facility for liquid cold plates and thermal assemblies. Our production capabilities include:
| Capability | Specification |
|---|---|
| Base materials | Copper (C1100, C1020), Aluminum (6061, 6063) |
| Joining methods | Vacuum brazing, friction stir welding (FSW), diffusion bonding |
| Surface finish | Electroless nickel plating, anodizing, bare copper |
| Pressure test | 100% hydrostatic leak test per unit |
| Certifications | ISO 9001, RoHS compliant |
| MOQ | 5 pcs (prototype) / 50 pcs (production) |
| Prototype lead time | 7–15 business days |
| Production lead time | 4–6 weeks |
Applications
ToneCooling AI server liquid cooling solutions are deployed across:
- Hyperscale data centers — GPU cluster cooling for LLM training infrastructure
- HPC facilities — High-density compute nodes requiring sustained cooling performance
- Edge AI servers — Compact 1U/2U deployments with space-constrained cooling budgets
- EV and power electronics — IGBT and power module cooling using the same cold plate technology
Why Engineers and Procurement Teams Choose ToneCooling
Direct manufacturer — No intermediary. You communicate directly with our engineering and production team.
Custom-first approach — Every cold plate can be dimensionally modified, ported differently, or finished to your specification. We do not push standard catalogue parts onto non-standard applications.
Fast prototype turnaround — 7–15 day prototype lead time means your thermal validation schedule stays on track.
Transparent quoting — DXF/STEP files + cooling requirements = detailed quotation within 48 hours.
Global supply capability — Shipping to North America, Europe, and Asia-Pacific with export documentation support.
Request a Quote for Your AI Server Cooling Project
Whether you are evaluating cold plates for a new GPU cluster design, retrofitting an existing air-cooled deployment, or sourcing production volumes for an OEM product — ToneCooling’s engineering team is ready to support your project from prototype to production.
Submit your requirements and receive a detailed quotation within 48 hours.
Related: Custom Liquid Cold Plates | AI Server Cooling | EV Battery Cooling
CFD Validated: Liquid Cold Plates for AI Server & HPC Workloads
As GPU and CPU TDPs continue to rise in AI inference and training servers, air cooling becomes insufficient above 300W per socket. Our CFD-validated liquid cold plates demonstrate controlled CPU temperatures even at 400W TDP per socket with 40°C inlet coolant — conditions typical of high-density rack deployments where ambient temperatures are elevated by adjacent equipment. The brazed + skived-fin construction ensures thermal cycling durability under continuous 24/7 operation.
| Parameter | Value |
|---|---|
| Target Platforms | Dual-socket CPU servers, GPU accelerator nodes |
| Validated TDP Range | 300W – 400W per processor |
| Max CPU Temperature @ 400W | 66.1°C (CPU2, inlet 40°C) |
| System Pressure Drop | 8.7 kPa |
| Coolant Compatibility | Water, Ethylene Glycol mixtures |
| Construction | Brazed copper/aluminum + skived fin |
Simulation performed using commercial CFD software. Results validated against experimental measurements. Contact ToneCooling for custom simulation and thermal design support.
Frequently Asked Questions
What is a nvidia gb200 liquid cold plate?
A nvidia gb200 liquid cold plate is a precision-engineered heat exchanger that uses liquid coolant flowing through internal channels to remove heat from high-power electronics, offering significantly higher thermal performance than air cooling. ToneCooling manufactures these for AI servers, data centers, EV batteries, and power electronics.
How does ToneCooling manufacture nvidia gb200 liquid cold plates?
ToneCooling manufactures nvidia gb200 liquid cold plates using vacuum brazing, friction stir welding, and CNC machining, with full in-house testing including pressure testing at 50 bar, helium leak detection, and thermal resistance measurement.
What materials does ToneCooling use?
ToneCooling uses 6061-T6 and 3003 aluminum alloys and oxygen-free copper (C11000). All materials meet RoHS compliance standards. Material selection depends on thermal conductivity requirements and coolant compatibility.
What is the minimum order quantity?
ToneCooling accepts orders from 1 piece prototypes to 10,000+ annual production. Prototype samples ship in 7-14 business days.
How do I get a quote for nvidia gb200 liquid cold plate?
Submit your thermal requirements, dimensions, and flow rate specifications via our quote request form. Our engineering team responds within 24-48 hours with a detailed technical proposal.
Industry References & Standards
Request AI Server Cold Plate Quote
- ✓ NVIDIA GB200/GB300/H200 platform support
- ✓ Direct-to-chip liquid cooling
- ✓ 80-120kW+ rack density enablement
- ✓ Prototype delivery in 7-15 business days
Request AI Cooling Solution Quote →
ISO 9001 Certified · MOQ 5 pcs · Prototype in 7-15 Days · Free CFD Simulation
Need a Custom Liquid Cold Plate?
Tell us your thermal requirements. Engineering team responds within 48 hours with design proposal and quotation.
Request a Quote →MOQ 5 pcs • Prototype 7-15 days • ISO 9001 Certified
