Custom liquid cold plates for IGBT, SiC and power electronics
IGBT Cold Plate RFQ Inputs and Manufacturing Review
Custom copper and aluminum liquid cold plates for EV inverters, OBC, DC-DC converters, industrial drives, rail traction, and high-power IGBT module cooling.
RFQ checklist
To Quote Your IGBT Liquid Cold Plate, Please Provide:
For a useful quotation, the thermal and hydraulic limits matter more than a generic size request.
- IGBT / SiC module model and footprint
- Heat loss per module or per switch position
- Coolant type and concentration
- Flow rate or system pump limit
- Maximum pressure drop
- Inlet temperature and target case temperature
- Mounting pattern and clamping force
- Port type, direction, and envelope limit
- Electrical isolation or creepage constraints
- Material preference and corrosion requirements
- Prototype and annual demand
- STEP / PDF drawings if available
Quick engineering answer
How We Approach IGBT Cold Plate Design
IGBT and SiC power modules generate concentrated heat at known mounting locations. A useful cold plate design starts with the module heat map, allowable case temperature, coolant condition, flow budget, pressure drop limit, and mechanical envelope.
ToneCooling selects the material, internal flow path, welding or brazing process, port design, flatness target, and leak test plan around those conditions. The goal is a manufacturable cold plate that fits the power stack, not a generic plate with uncertain loop performance.
Design inputs
Key Engineering Requirements
Thermal Load
Heat loss per IGBT or SiC module, hot spot location, switching duty, and allowable case temperature define the thermal resistance target.
Hydraulic Budget
Coolant, flow rate, inlet temperature, port size, and maximum pressure drop determine channel layout and manifold balance.
Mechanical Interface
Mounting pattern, flatness, surface finish, stack-up tolerance, and clamping force control contact resistance and assembly repeatability.
Material Selection
Copper improves heat spreading. Aluminum can reduce mass and cost when pressure, corrosion, and thermal requirements allow it.
Reliability
Thermal cycling, coolant compatibility, leakage prevention, galvanic corrosion, and cleaning requirements must be reviewed before production.
OEM Integration
Port location, bracket clearance, module service access, insulation clearance, and assembly sequence are checked during DFM.
Architecture
Recommended Cold Plate Structures
High heat flux IGBT modules
Useful when heat spreading and thermal resistance are the main constraints.
Complex internal flow paths
Suitable when the design needs a sealed internal channel network and controlled distribution.
Weight-sensitive OEM assemblies
Often considered for aluminum systems where pressure, flatness, and corrosion requirements are compatible.
Cost-controlled programs
Can be practical for moderate heat loads, simpler geometry, and faster prototype needs.
Example design targets
Typical Parameters to Define Before Quotation
Final values depend on module layout, coolant, flow rate, inlet temperature, pressure drop limit, and customer test conditions.
| Parameter | Engineering Notes |
|---|---|
| Heat load | Defined by inverter or power module loss calculation; final value depends on customer design conditions. |
| Coolant | Pure water, water-glycol, or dielectric coolant where specified; final value depends on customer design conditions. |
| Flow rate | Matched to loop capacity and pressure drop budget; final value depends on customer design conditions. |
| Pressure drop | Controlled by internal channel geometry and port design; final value depends on customer design conditions. |
| Thermal resistance | Targeted from case temperature limit and heat load; final value depends on customer design conditions. |
| Material | Copper or aluminum selected after thermal, weight, cost, and corrosion review. |
| Manufacturing process | CNC machining, vacuum brazing, FSW, tube press-in, or combined process depending on geometry. |
| Leak test | Pressure level and acceptance criteria are confirmed according to working pressure and customer standard. |
| Surface flatness | Specified around module contact area, mounting pattern, and TIM requirement. |
Engineering review
Thermal and Hydraulic Validation Support
For custom programs, ToneCooling can review cold plate geometry against the heat source layout, coolant path, pressure drop target, and manufacturability before prototype release.
Applications
Power Electronics Applications
Manufacturing
Manufacturing and Quality Capability
CNC Machining
Precision machining for interface surfaces, ports, mounting features, and custom mechanical envelopes.
Brazing and FSW
Process selection based on material, channel design, pressure target, and production volume.
Leak Testing
Leak test method, pressure, and acceptance limit are defined according to customer requirements.
Prototype Build
Prototype and low-volume builds support engineering validation before batch production.
DFM Review
Drawing review covers manufacturability, sealing, flatness, ports, tolerances, cleaning, and assembly risk.
Batch Production
Repeatable manufacturing control for OEM power electronics programs after design freeze.
FAQ
IGBT Liquid Cold Plate FAQ
Can ToneCooling design a custom IGBT liquid cold plate?
Yes. ToneCooling designs custom cold plates around IGBT and SiC module footprints, thermal loads, coolant conditions, pressure drop limits, and OEM mechanical envelopes.
What information is needed for an IGBT cold plate quote?
Please send module drawings, heat loss, coolant type, flow rate, pressure drop limit, inlet temperature, target case temperature, mounting pattern, port requirements, quantity, and drawings if available.
Which process is best: copper brazing, FSW, or tubed cold plate?
The process depends on heat flux, material, pressure target, geometry, quantity, and cost. ToneCooling reviews the application before recommending a process.
Can you support high pressure requirements?
Pressure capability depends on structure, material, wall thickness, joining method, port design, and test specification. Final values are confirmed during DFM and validation.
Do you provide DFM review before production?
Yes. DFM review covers sealing, internal channel manufacturability, tolerance stack-up, flatness, surface finish, port design, and leak test requirements.
Can you support prototype and mass production?
Yes. ToneCooling supports prototype, pilot, and batch production after the cold plate geometry and test requirements are confirmed.
Engineering support pages
Related Power Electronics Cold Plate Guides
Use these support pages for narrower engineering questions. They support this IGBT RFQ page and do not replace the main commercial quote path.
SiC Power Module Cold Plates
Review SiC module footprint, heat loss, insulation clearance, coolant path, and pressure drop inputs.
Copper Cold Plates for Power Electronics
Compare copper heat spreading, brazed structures, coolant compatibility, flatness, and RFQ tradeoffs.
DFM and Leak Testing
Prepare manufacturability, sealing, pressure test, inspection, and validation inputs before prototype release.
Ready for engineering review?
Send Your IGBT Module Drawing and Thermal Requirements
Share the heat loss, coolant, flow rate, pressure drop limit, inlet temperature, module footprint, mounting pattern, port direction, and annual demand. ToneCooling engineering will review the requirements and respond with a manufacturable cold plate approach.
