Data Center Liquid Cold Plates for AI Server and GPU Cooling Projects

Platform Image Map: GB200, GB300, H200 and SP5 Cold Plate RFQ Review

Use these image groups to choose the closest RFQ path. Each platform still requires the official mechanical drawing, heat load, coolant, flow target and pressure-drop limit before quotation.

GB200 GPU Cold Plate

Use this path for GB200 AI server GPU cold plate projects. Send the official GB200 platform drawing, module envelope, heat load, coolant, flow rate and pressure-drop target before RFQ review.

GB300 GPU Cold Plate

Use this path for GB300 AI accelerator cold plate projects. Send the official GB300 platform drawing, module envelope, heat load, coolant, flow rate, pressure-drop target and validation requirements before quotation.

H200 GPU Cold Plate

Use this path for H200 GPU liquid cooling projects where port layout, mounting space, coolant routing and validation requirements must match the server assembly.

AMD EPYC SP5 CPU Cold Plate

Use this path for SP5 CPU direct-to-chip cooling projects. Provide socket footprint, mounting interface, stack height, coolant, flow rate and pressure-drop limit.

GB200 Liquid Cooling Board Technical Data From Product Introduction

The table below standardizes the GB200 data found in the supplied ToneCooling Product Introduction PDF. Use it as an RFQ screening reference; final quotation still requires the approved drawing, port definition, coolant loop requirement and validation criteria.

Source used for this section: supplied ToneCooling Product Introduction PDF, page 1.

What Is a Data Center Liquid Cold Plate?

A data center liquid cold plate is a liquid-cooled metal component that transfers heat from processors, GPUs, accelerators or power electronics into a coolant loop. For custom projects, the design depends on the heat source map, coolant, flow rate, pressure-drop limit, material, channel geometry, port layout and test requirements.

This page is for the global ToneCooling manufacturing site. USA, Australia and Europe local RFQ intent should be handled by the correct regional sites and should not be mixed into this global page.

Data Center Cooling Applications Reviewed

Design Inputs Needed Before Quotation

Manufacturing Routes for Data Center Cold Plates

Depending on the drawing, material and channel layout, ToneCooling can review CNC machined, vacuum brazed, friction stir welded, diffusion bonded, copper, aluminium or microchannel cold plate routes. Final process selection requires DFM review and confirmed project requirements.

• CNC machined cold plates: useful when channel access, machining sequence and sealing route can be controlled by the drawing.
• Vacuum brazed cold plates: considered when internal channels, material compatibility and joint design match the validation requirement.
• FSW cold plates: often reviewed for aluminium projects where weld path access, channel geometry and port layout fit the process.
• Diffusion bonded or microchannel cold plates: reviewed only when geometry, cleanliness and validation requirements justify the route.

Leak Testing, Inspection and Validation Requirements

Specify required leak testing, pressure testing, cleanliness, flatness, surface treatment, documentation and validation stage in the RFQ. Exact test values and acceptance criteria should come from the customer specification or approved ToneCooling process records.

Terms such as GB200, GB300, H200, NVIDIA, hyperscale, IATF, ISO, 1200W and 24h can appear when relevant as project entities. They should not be used as unsupported guarantees for compatibility, certification scope, delivery time or thermal performance.

FAQ