AMD EPYC SP5 dual-CPU cooling
AMD SP5 CPU Liquid Cold Plate 550 W × 2 DUAL-CPU PLATE SET
Copper liquid cold plate set for AMD EPYC SP5 (LGA-6096) dual-CPU servers: two TLP diffusion-bonded copper-T2 plates rated 550 W per CPU, factory-fitted with EPDM hoses and 316L UQD02 quick disconnects — CFD validated before tooling, 100% leak and flow tested as a sealed set.
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Download datasheet (PDF)
Key specifications
| Model | T-HS202301 — AMD SP5 dual-CPU liquid cold plate set |
|---|---|
| Thermal design power | 550 W per CPU × 2 plates (series loop) |
| Plate material | Copper T2, sandblasted and nickel plated; 6061-T6 black hard-anodized frame |
| Joining method | Transient liquid-phase (TLP) diffusion bonding, one-piece weld |
| Coolant temperature rise | <11°C first-stage plate, <19°C second-stage plate (series flow) |
| Rated flow / pressure drop | 1 LPM; 9±2 kPa per plate, 21±2 kPa full set including hoses and quick disconnects |
| Working fluid / supply temp | Pure water at 25°C supply temperature |
| Test pressure | 1 MPa nitrogen pressure-decay, 300 s hold, <10 kPa drop — 100% of units |
| Wetted materials | Copper T2 plate body ×2, 316L UQD02 quick-disconnect couplings ×2, EPDM tubing ×3 |
| Mounting / interface | AMD SP5 spring-screw mounting; TC-5888 thermal interface material (5.2 W/m·K) |
| ΔP–flow curve | Measured ΔP–flow curve is supplied with the prototype test report and DFM review — request it with your drawing |
| CAD / drawings | STEP model and 2D drawing available under NDA — request with your RFQ |
AMD SP5 CPU Liquid Cold Plate datasheet (PDF)
Full specification table, wetted materials, test conditions and routine inspection criteria — ready to drop into your thermal review.
ToneCooling manufactures AMD SP5 liquid cold plate sets rated 550 W per CPU for EPYC (LGA-6096) dual-socket servers — sealed, leak-tested assemblies with 316L UQD02 quick disconnects, built under ISO 9001 at our Guangdong technical center, with North American customers supported by ToneCooling Texas LLC.
Why ToneCooling
Design, engineering, and manufacturing run in-house at the ToneCooling technical center in Guangdong — one accountable partner from CFD model to leak-tested hardware. Every SP5 set ships as a sealed, ready-to-install assembly with the documentation your qualification process needs in the box: dimensional inspection report, flow-resistance report, seal-test report and factory certificate. Prototype orders start at 5 pieces with a 7–15 business day lead time.
Validation on every unit
Seal testing — each plate and each complete set is nitrogen pressure-decay tested at 1 MPa with a 300-second hold; pressure drop must stay under 10 kPa.
Flow resistance — every set is verified at 1 LPM / 25°C pure water against the 21±2 kPa acceptance window, including hoses and quick disconnects.
Thermal performance — sampled per AQL 0.065 on a calibrated simulated heat source at 550 W to steady state, logging inlet/outlet temperatures, flow and pressure drop.
Real factory test report for the SP5 plate set (PDF)
Not a brochure — the actual quality-department inspection record: sealability test at 1 MPa / 5 min, bench-measured flow resistance with the calculation shown, test photos and inspector sign-off. The same report format ships with every order.
Applications
AMD EPYC SP5 (LGA-6096) dual-socket servers on direct-to-chip liquid cooling — 4th and 5th Gen EPYC platforms where 550 W per socket ends air cooling. One series loop covers both sockets, arriving as a single sealed assembly with quick disconnects ready for the rack manifold. For single-socket or other AMD platforms, see the SP3 and SP6 plates.
Engineering Support Pages for CPU Cold Plate RFQs
Use these pages to prepare socket drawings, heat load, coolant, flow rate, pressure-drop target, port layout, validation scope and module envelope before quotation.
AMD EPYC SP5 RFQ InputsSocket reference, module envelope, coolant, flow rate and pressure-drop target.Server CPU Cold Plate RFQ ChecklistDrawing, heat load, coolant, pressure-drop and validation inputs.
Pressure Drop and Flow Rate ReviewPrepare flow rate, coolant, inlet temperature and pump pressure budget.
Port Layout and Hose RoutingReview fitting direction, hose clearance, bend radius and service access.
Leak, Pressure and Cleanliness ValidationDefine leak test, pressure test, cleanliness and documentation scope.AMD SP5 CPU Liquid Cold Plate FAQ
What does the SP5 plate set include?
Two copper-T2 cold plates with factory-fitted EPDM hoses and 316L UQD02 quick-disconnect couplings — one sealed assembly per dual-CPU node, leak tested as a set before shipment.
Which EPYC generations does the SP5 set cover?
SP5 (LGA-6096) spans 4th and 5th Gen AMD EPYC. The set mounts with SP5 spring screws and TC-5888 interface material (5.2 W/m·K); confirm your CPU SKU and board layout on the drawing during DFM.
Why is the set rated as a series loop?
Both plates run in series on one 1 LPM circuit — the second-stage plate sees warmer coolant, which is why the specification separates first-stage (<11°C) and second-stage (<19°C) temperature rise.
What coolant should be used?
Rated performance is specified with pure water at a 25°C supply temperature. Data-center loops following ASHRAE W55 water quality are supported; glycol mixtures are reviewed during DFM.
What flow rate does it need?
1 LPM under rated load, with 21±2 kPa pressure drop across the full set including hoses and quick disconnects — checked against your pump budget during engineering review.
Can the design be customized?
Yes. Hose lengths, quick-disconnect type, mounting hardware and surface finish are customized from your drawings. CFD simulation validates any change before tooling.
What is the MOQ and lead time?
Prototype MOQ is 5 pieces with a 7–15 business day lead time from approved drawing and PO; production runs 4–6 weeks.
How is quality verified before shipment?
100% nitrogen pressure-decay seal testing at 1 MPa and 100% flow-resistance verification, plus AQL-sampled thermal testing. The inspection reports ship in the box with each set.
Request a quote
Send your drawing, heat map, coolant, and flow budget to info@tonecooling.com or use the quote form — the engineering team returns a manufacturable concept with the quotation. MOQ 5 pcs, prototype in 7–15 business days.
Send drawings for engineering review or download the datasheet (PDF)
Official Platform References
Use these OEM platform pages as reference context only. ToneCooling RFQ review still requires the customer-approved drawing, module envelope, heat load, coolant, flow rate and pressure-drop target.
