Server CPU Liquid Cold Plates — Direct-to-Chip
ToneCooling manufactures custom Direct-to-chip server CPU liquid cold plates for Intel and AMD platforms (LGA4189, LGA4677, LGA3647, LGA7529, AMD SP3/SP5) in 1U/2U/4U server form factors. Copper micro-channel, vacuum-brazed and skived constructions. Each model below ships with a downloadable engineering datasheet.
Server CPU Liquid Cold Plate Models — Download Datasheets (42)
Friction-Stir-Welded CPU / Processor Liquid Cold Plate
CPU / Processor Liquid Cold Plate
CPU / Processor Liquid Cold Plate
CPU / Processor Liquid Cold Plate
Server CPU Cold Plate RFQ Review Inputs
For direct-to-chip CPU cooling projects, the useful RFQ path starts with the socket layout, module envelope, heat load, coolant, flow target and pressure-drop limit. Use the cards below to prepare the engineering inputs before quotation.
AMD EPYC SP5 CPU Cold Plate
AMD EPYC SP3 CPU Cold Plate
Intel LGA4677 Liquid Cold Plate
Intel LGA7529 Liquid Cold Plate
1U / 2U Server Envelope
Flow Rate and Pressure Drop
Leak, Pressure and Cleanliness
Engineering Support Pages for Server CPU Cold Plate RFQs
Use these pages to prepare socket drawings, heat load, coolant, flow rate, pressure-drop target, port layout, validation scope and module envelope before quotation.
Server CPU Cold Plate RFQ ChecklistDrawing, heat load, coolant, flow, pressure-drop and validation inputs. Pressure Drop and Flow Rate ReviewPrepare flow rate, coolant, inlet temperature and pump pressure budget. Leak, Pressure and Cleanliness ValidationDefine leak test, pressure test, cleanliness and documentation scope. Port Layout and Hose RoutingReview fitting direction, hose clearance, bend radius and service access. AMD EPYC SP5 RFQ InputsSocket reference, module envelope, coolant, flow and pressure-drop target. AMD EPYC SP3 RFQ InputsPrepare socket layout, heat-source map, coolant and validation needs. Intel LGA4677 RFQ InputsMounting footprint, port direction, envelope and service access review. Intel LGA7529 RFQ InputsSocket reference, module envelope and direct-to-chip cooling constraints. High-Power 1000 W to 1500 W ReviewUse for high-density thermal load, channel route and validation planning. Server Module Envelope Review1U, 2U and custom chassis envelope, tube route and service access.Frequently Asked Questions
Which server CPU sockets do your cold plates support?
Intel LGA4189, LGA4677, LGA3647, LGA7529, LGA2066 and AMD SP3/SP5 – single and multi-socket, 1U/2U/4U. Custom sockets on request.
What construction methods do you use?
Copper micro-channel with vacuum brazing or skived fins for high heat flux; aluminium options for cost-sensitive builds.
What flow and pressure-drop targets can you hit?
We tune channel geometry to your flow rate, pressure-drop limit and inlet temperature; CFD validation is available before tooling.
What information should be sent before quotation?
Send the socket or platform drawing, heat load, coolant, flow rate, pressure-drop target, envelope, port direction, quantity and validation requirements. Prototype and production schedule are confirmed after drawing review.
Do you provide a datasheet for each model?
Yes – a downloadable single-page engineering datasheet (PDF) is available for every model below.
Need a custom server CPU cold plate?
Send your socket, flow rate, pressure-drop limit and inlet temperature – we review manufacturability before quoting.
Request RFQ
