TC-LGA 9324 CPU Cooler: Redefining Thermal Boundaries for High-Performance Computing

Design Context and Requirements
With the launch of Intel’s next-generation TC-LGA 9324-packaged processors (e.g., the rumored Xeon Ultra 9000 series), their peak TDP of 800W poses unprecedented thermal challenges. Traditional air and liquid cooling solutions are inadequate for high-density compute nodes. The TC-LGA 9324 Cooler is engineered for 5nm/3nm process, high-core-density CPUs, targeting sub-70°C core temperatures under extreme loads and quiet operation below 40dB.

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ToneCooling 1U-FA31 (EVAC) CPU Cooler thermal management
TC-LGA9324-1U-FA31 (EVAC) CPU Cooler
LGA9324-1U-FWA31 CPU Cooler
Efficient Cooling Applications

Optimized heat dissipation design ensures stable operation under high loads.

Durability Applications

Made from high-quality materials, enhancing long-term reliability and durability.

Custom Solutions Applications

Provides tailored solutions based on client needs, meeting specific application requirements.

Energy Efficiency Applications

Effective cooling reduces energy consumption, adhering to environmental standards.

Why choose Coolserver for server cooling?

Advantages and Value of Coolserver for Industrial Automation Cooling:

  • High Efficiency: Coolserver’s designs offer effective heat dissipation, ensuring optimal performance of industrial machinery.
  • Reliability: Robust construction withstands harsh environments and heavy-duty operations, enhancing equipment longevity.
  • Customization: Tailored cooling solutions address specific automation needs, improving overall system efficiency.
  • Energy Savings: Enhanced cooling reduces energy consumption, lowering operational costs and promoting sustainability.

Applications and Industry Impact

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Next-Gen Data Centers

ToneCooling Wide flow channel spoiler thermal management

AI Supercomputing & Hybrid Quantum Systems

ToneCooling K800-104 wide flow channel structure thermal management

Edge Computing & Harsh Environments

ToneCooling ae6d6d826f3613a18c7181fbc0eff03e89825bbb7af9d-HpSpg6_fw1200 thermal management

Workstations

More Information

1. What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.
2. What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat- flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
3. What are we currently researching and developing?
We are currently researching and developing high-power, high-heat-flux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductivity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.