TC-LGA2011 Narrow CPU Cooler: Optimized Thermal Solution for Intel Xeon E5 & EP Server Platforms
Designed for Space-Constrained Server Deployments with Sustained High-TDP Loads
Optimized heat dissipation design ensures stable operation under high loads.
Made from high-quality materials, enhancing long-term reliability and durability.
Provides tailored solutions based on client needs, meeting specific application requirements.
Effective cooling reduces energy consumption, adhering to environmental standards.
Why choose Coolserver for server cooling?
Advantages and Value of Coolserver for Industrial Automation Cooling:
- High Efficiency: Coolserver’s designs offer effective heat dissipation, ensuring optimal performance of industrial machinery.
- Reliability: Robust construction withstands harsh environments and heavy-duty operations, enhancing equipment longevity.
- Customization: Tailored cooling solutions address specific automation needs, improving overall system efficiency.
- Energy Savings: Enhanced cooling reduces energy consumption, lowering operational costs and promoting sustainability.
Product Overview & Target Applications
Dual-socket 1U/2U rackmount servers
Cloud infrastructure and virtualization clusters
Enterprise storage systems and hyperconverged infrastructure (HCI)
Telco-grade edge servers and micro-datacenters
More Information
1. What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.
2. What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat- flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
3. What are we currently researching and developing?
We are currently researching and developing high-power, high-heat-flux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductivity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.
