TC-LGA 115X/1200 CPU Cooler: Reliable, Compact Cooling for Mainstream Intel Platforms

Designed for Optimal Thermal Performance in Office PCs, Embedded Systems, and Edge Servers

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ToneCooling LGA115X-R28 CPU Cooler thermal management
ToneCooling TC-LGA115X-1U3CC-CPU-Cooler server rack thermal management
ToneCooling TC-LGA115X-1U3C-CPU-Cooler server rack thermal management
ToneCooling TC-LGA115X-1U1CA CPU Cooler thermal management
ToneCooling TC-LGA115X-1U1C CPU Cooler thermal management
ToneCooling LGA115X-W1 CPU Cooler thermal management
Efficient Cooling Applications

Optimized heat dissipation design ensures stable operation under high loads.

Durability Applications

Made from high-quality materials, enhancing long-term reliability and durability.

Custom Solutions Applications

Provides tailored solutions based on client needs, meeting specific application requirements.

Energy Efficiency Applications

Effective cooling reduces energy consumption, adhering to environmental standards.

Why choose Coolserver for server cooling?

Advantages and Value of Coolserver for Industrial Automation Cooling:

  • High Efficiency: Coolserver’s designs offer effective heat dissipation, ensuring optimal performance of industrial machinery.
  • Reliability: Robust construction withstands harsh environments and heavy-duty operations, enhancing equipment longevity.
  • Customization: Tailored cooling solutions address specific automation needs, improving overall system efficiency.
  • Energy Savings: Enhanced cooling reduces energy consumption, lowering operational costs and promoting sustainability.

Target Applications

ToneCooling K800-104 wide flow channel structure thermal management

Office PCs and educational systems

ToneCooling 1736227754220 thermal management

Thin-client terminals and embedded computers

ToneCooling Wide flow channel spoiler thermal management

Industrial and automation controllers

ToneCooling K800-104 wide flow channel spoiler structure thermal management

Edge computing and microservers

More Information

1. What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.
2. What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat- flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
3. What are we currently researching and developing?
We are currently researching and developing high-power, high-heat-flux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductivity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.