Custom 3D Vapor Chamber China Manufacturer & Supplier
Tone Cooling is your trusted China manufacturer of 3D Vapor Chambers, offering tailored thermal management solutions for various industries. Our high-performance 3D vapor chambers are designed to provide superior heat dissipation and reliability, ensuring optimal efficiency in your products. With a focus on customization, we deliver precise, cost-effective solutions that meet your specific cooling needs.
Features of Our 3D Vapor Chambers
- Three-Dimensional Heat Spreading – Efficiently distributes heat across complex surfaces.
- High-Density Fin Structures – Features advanced fin designs for enhanced surface area.
- Customizable Size – Can be tailored to fit specific thermal needs.
- Energy Efficiency – Reduces the need for additional cooling systems.
- High Heat Load Capacity – Handles large thermal loads effectively.
- Compact Design – Ideal for space-constrained, high-performance devices.
- Isothermal Temperature Control – Maintains even temperatures across the device.
Tone Cooling's 3D Vapor Chambers: Advanced Thermal Management Solutions
Tone Cooling‘s 3D vapor chambers are the next-generation thermal management solutions designed to efficiently distribute heat across complex, three-dimensional surfaces. Starting with a 2D flat heat spreader—a base that evenly distributes heat across its surface—multiple heat pipes are welded onto the chamber. These heat pipes, customizable in number, efficiently transport heat from the source to other areas within the assembly.
Muti Fins are stacked through the heatpipes, forming multiple layers that create a compact and high-performance structure. This design maximizes the surface area for heat dissipation, ensuring that heat is quickly transferred and dispersed into the surrounding environment.
Optimize your device’s thermal performance with our custom vapor chambers, designed to meet your unique cooling needs. Contact us today to create the perfect solution for efficient, high-performance heat dissipation!
The 3D vapor chamber spreads heat evenly across three-dimensional surfaces, unlike traditional heat pipes that work along a single axis. This makes it much more effective in managing high thermal loads and preventing localized hotspots, which is crucial for high-performance devices.
By maintaining even temperatures across the device, the 3D vapor chamber ensures components stay within their optimal operating ranges. This reduces the risk of thermal throttling and other heat-related issues, thereby increasing the overall reliability and longevity of the device.
Made from sustainable materials like copper and aluminum, our 3D vapor chambers are highly recyclable, reducing environmental impact. By ensuring optimal heat distribution and energy efficiency, they can contribute to long-term sustainability, making them an eco-friendly solution for high-performance applications.
Efficient heat management directly impacts the longevity of electronic components. By preventing overheating and maintaining consistent temperatures, 3D vapor chambers extend the lifespan of critical components, ensuring devices last longer before requiring maintenance or replacement.
Why Choose Tone Cooling For 3D Vapor Chambers
With over 20 years of expertise in thermal management, Tone Cooling is a trusted partner incooling solutions. Our advanced R&D team, supported by advanced technologies and multiple patents, ensures that each 3D vapor chamber is engineered for maximum heat dissipation, reliability, and energy efficiency.
We work with industry giants like Intel and NVIDIA, offering highly customized solutions that meet the most demanding performance needs. Tone Cooling delivers fast, cost-effective, and sustainable thermal solutions tailored to your specific requirements, helping you optimize your device’s performance while contributing to environmental sustainability.
Applications of 3D Vapor Chambers
Electronics and Computing Applications
Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
Telecommunications Applications
Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat
Automotive Industry Applications
Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
Aerospace Applications
Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
FAQs
1. What is a 3D vapor chamber?
A 3D vapor chamber is a sophisticated thermal management system designed to efficiently spread heat across a surface. It uses a sealed chamber filled with liquid that absorbs heat, turns into vapor, and spreads out, cooling before condensing back into liquid.
This process repeats for continuous heat dissipation. The design includes a base vapor chamber for even heat distribution, welded heat pipes for enhanced heat transfer, and stacked fins to increase surface area for cooling.
2. What is the difference between a 3D vapor chamber and a traditional heat pipe?
The key difference between a 3D vapor chamber and a traditional heat pipe is the design. A heat pipe typically has a cylindrical shape and operates on the same phase change principle but only moves heat in one direction.
In contrast, a 3D vapor chamber has a flat, larger surface area and can distribute heat more evenly in all directions, making it more effective for compact devices with heat-sensitive components. The vapor chamber is often more efficient in high-performance environments.
1. Are 3D vapor chambers eco-friendly?
3D vapor chambers are generally considered eco-friendly as they are often made from sustainable materials, and because they efficiently manage heat, they can reduce the need for additional power and cooling, which helps in saving energy.
2. Can 3D vapor chambers be repaired or replaced?
Yes, 3D vapor chambers can be replaced if damaged, but repair is often not feasible because of their intricate design. If the chamber is cracked, leaking, or otherwise compromised, replacement is usually the best option. It’s crucial to ensure proper care and maintenance for longevity.
3. Where are 3D vapor chambers commonly used?
3D vapor chambers are widely used in electronics that generate significant heat, such as smartphones, laptops, gaming consoles, and other high-performance devices.
They’re also used in automotive applications, LED lighting systems, and some medical equipment to manage heat efficiently. Their ability to provide effective thermal management makes them ideal for spaces with limited room for traditional cooling methods.
4. What are the benefits of using a 3D vapor chamber?
The main benefits of a 3D vapor chamber are improved heat dissipation, better thermal management, and enhanced device performance.
By evenly distributing heat across the device, it helps to prevent overheating and prolongs the life of components.
This makes 3D vapor chambers especially useful in small, high-performance devices where traditional cooling systems can be too bulky or inefficient.
5. Are 3D vapor chambers suitable for all types of devices?
While 3D vapor chambers are highly effective for most modern electronic devices, they may not be suitable for all types.
Devices that don’t generate a lot of heat or those with enough space for larger cooling systems may not benefit from using a vapor chamber.
Vapor Chamber Technical/Data Sheet
| Substrate size | 50-45-4 |
| Heat pipe size | D6*L240*N3 |
| Power | 120W |
| Heat flux density | 37(W/cm2) |
| Heat source size: | 18*18mm |
| Application industry | Optical Module |
3D temperature plates (3DVC) can be customized
| Maximum size | 400 x 300 mm |
| Tube length | 30-300 mm |
| Tube structur | bendable and flattened |
| Maximum power | 1500W |
3DVC Heat Sink
| POWER(W) | Tc (°C) | Ta (°C) | AT (°C) | R (C/W) |
| 115 | 39.5 | 25.2 | 14.3 | 0.124 |
| 165 | 45.3 | 25.1 | 20.2 | 0.122 |
| 215 | 51.1 | 25.4 | 25.7 | 0.12 |
| 265 | 57 | 25.6 | 31 .4 | 0.118 |
| 315 | 62.5 | 25.4 | 37.1 | 0.118 |
| 365 | 68 | 25.6 | 42.4 | 0.116 |
HP Heat Sink
| POWER(W) | Tc (°C) | Ta (°C) | AT (°C) | R (C/W) |
| 115 | 46 | 25 | 21 | 0.183 |
| 165 | 54.3 | 24.9 | 29.4 | 0.178 |
| 215 | 62.8 | 25.1 | 37.7 | 0.175 |
| 265 | 69.4 | 25.1 | 44.3 | 0.167 |
| 310 | 81.1 | 25.1 | 56 | 0.181 |
| Copper Tube Diameter | Min. A(mm) | Min. B(mm) | Min. C(mm) | Min. D (mm) | Min. E(mm) | Min. F(mm) | Min.G(mm) |
| 6 | 13 | 13 | 34 | 16 | 3.2 | 6 | 3 |
| 8 | 14 | 14 | 36 | 18 | 3.2 | 8 | 3 |
| 10 | 15 | 15 | 38 | 20 | 3.2 | 8 | 3 |
| 12 | 16 | 16 | 40 | 22 | 3.2 | 10 | 3 |
