Liquid Cooling Plates in HVDC Transmission: A Case Study
The Growing Demand for Efficient Cooling in HVDC Systems
As global electricity consumption rises, Flexible HVDC (High-Voltage Direct Current) transmission systems have become essential for efficient long-distance power transfer. The valve group, a core component of these systems, relies on power semiconductor devices (IGBTs, thyristors) that generate significant heat during operation.
The Thermal Challenge in HVDC Systems
Semiconductor devices in HVDC converters produce high heat flux (500+ W/cm²)
Prolonged exposure to temperatures above 150°C leads to device degradation, failures, and even explosions
Traditional air cooling fails to meet cooling demands, causing:
Thermal throttling (reduced efficiency)
Increased failure rates (costly downtime)
Higher maintenance costs
Liquid cooling plates have emerged as the optimal solution, ensuring stable, efficient, and long-lasting HVDC performance.
Why Liquid Cooling Outperforms Air Cooling in HVDC Systems
Heat Transfer Efficiency Comparison
Cooling Method | Heat Transfer Coefficient (W/m²·°C) | Key Limitations |
---|---|---|
Air Cooling | 700–1,500 | Inefficient for high-power systems |
Heat Pipe Cooling | 3,000 | Limited scalability |
Liquid Cooling Plates | 25,000+ | Superior cooling, compact design |
Key Advantages of Liquid Cooling Plates
✔ 25,000 W/m²·°C Heat Transfer – 35x more efficient than air cooling
✔ Prevents Thermal Runaway – Maintains safe operating temperatures (<85°C for IGBTs)
✔ Uniform Heat Distribution – Eliminates hot spots, extending device lifespan
✔ Compact & Lightweight – Ideal for high-density HVDC valve modules
✔ Energy Efficient – Reduces cooling power consumption by 40-60%
Real-World Application: Liquid Cooling in HVDC Transmission
Case Study: Offshore Wind Farm HVDC Link
Challenge:
High-power IGBT modules overheating in salt-rich, humid environments
Frequent shutdowns due to thermal stress
Solution:
Sealed liquid cooling plates with corrosion-resistant materials
Microchannel cooling for maximum heat dissipation
Results:
✅ 30°C lower operating temperatures (preventing thermal throttling)
✅ 50% reduction in failure rates
✅ Zero unplanned outages in 24 months
Case Study: Urban HVDC Power Transmission
Challenge:
Space constraints in urban substations
Air cooling too noisy & inefficient
Solution:
Modular liquid cooling plates integrated into valve towers
AI-driven flow control for dynamic cooling
Results:
✅ 25% smaller footprint vs. air-cooled systems
✅ Near-silent operation (ideal for populated areas)
✅ 20% higher energy efficiency
Future Trends: Next-Gen Liquid Cooling for HVDC
1. Two-Phase Cooling
Uses boiling/condensation cycles for 50% higher efficiency
Already being tested in ultra-high-voltage (UHV) converters
2. Nanofluid-Enhanced Cooling
Graphene & carbon nanotube coolants improve heat transfer by 3x
Extends component lifespan by reducing thermal cycling stress
3. Smart Predictive Cooling with AI
Machine learning algorithms predict heat loads and adjust cooling in real time
Prevents thermal fatigue in IGBT modules
Conclusion: Why Liquid Cooling is the Future of HVDC Systems
✔ 25,000 W/m²·°C heat transfer (vs. 1,500 for air cooling)
✔ Prevents IGBT failures at 150°C+
✔ Reduces maintenance costs by 50%
✔ Scalable for next-gen UHV transmission
Case customer: A power customer in Northeast China
▶Design requirements
The flatness of the contact surface with the heating element should be less than or equal to 20 micrometers (µm).
The parallelism of the contact surface with the heating element should be ≤ 40 µm.
Vickers hardness of the contact surface with the heating element is greater than 75 HB.
The contact surface of the heating element undergoes surface treatment with nickel plating, which has a thickness of 8 to 12 micrometers.

▶Design

▶Appearance
Heat source: IEGT/IGBT
Heat dissipation: 4000W*2 (double-sided)
Material: aluminum alloy
Process: friction welding
Working fluid: pure water
Pressure drop: 35kpa@5LPM
Size: 175mm*175mm*25mm
Application area: flexible DC transmission
