Custom IGBT Cold Plates for Power Electronics OEMs
ToneCooling develops and manufactures custom IGBT liquid cold plates for traction inverters, energy-storage power conversion systems and industrial drives. Share your power-module layout, semiconductor losses and coolant conditions for an OEM engineering review.
Cooling requirements are based on device heat losses and thermal limits, not the inverter power rating alone.
Specify Your IGBT Module Cooling Interface
An IGBT cold plate transfers heat from the power-module baseplate into the coolant. The module footprint, heat-source distribution, thermal-interface material and mounting method must be reviewed together with the internal flow path.
- Heat load: switching and conduction losses, continuous and transient duty, and allowable module baseplate temperature.
- Mounting: module drawing, hole pattern, contact area, flatness, TIM thickness and supplier-specified clamping requirements.
- Cooling loop: coolant type, inlet temperature, available flow, pressure-drop budget and operating pressure.
- Qualification: leak acceptance limit, pressure-test conditions, corrosion requirements and thermal validation scope.
- Supply: prototype quantity, annual forecast, inspection documents and target schedule.
Review vacuum-brazed cold plates and friction stir welded cold plates against your geometry and joining requirements. Start with the engineering RFQ checklist.
Liquid cold plates directly contact IGBT modules and use the high heat capacity and thermal conductivity of the liquid to quickly absorb and dissipate generated heat, ensuring the module operates within an optimal temperature range.
Compared to traditional air-cooling systems, liquid cold plates have a compact design that efficiently utilizes limited space, making them ideal for high-power-density applications with space constraints.
Liquid cold plates provide even cooling, preventing localized overheating, reducing failure rates, and improving the overall reliability and safety of the system.
Liquid cold plates can be customized to fit different IGBT module sizes and power requirements, making them suitable for a wide range of applications in data centers, electric vehicles, medical equipment, telecommunications, and industrial sectors.
Request an IGBT Cold Plate RFQ Review
Send the module layout, loss map, mechanical drawing, coolant conditions and expected quantities. Our review will identify interface and manufacturing questions before quotation.
Check the RFQ inputs and submit your project requirements. Performance targets and validation scope are agreed for your application.
Applications That Require IGBT Liquid Cold Plates
EV Traction Inverters
Provide switching and conduction losses over the drive cycle, module layout and coolant limits. Review mounting and thermal-interface requirements for the specified operating points.
Energy Storage PCS and Solar Inverters
Define sustained losses, inlet-temperature range and coolant allocation within the enclosure. Assess module temperature and pressure drop under the agreed continuous-duty conditions.
Industrial Motor Drives
Review the drive duty cycle, power-module losses, installation envelope and coolant-loop conditions. Specify the mounting interface and acceptance tests needed for the equipment.
Rail Traction Converters
Supply the module layout, heat-load profile and project-specific vibration, environmental and inspection requirements. Rail application suitability requires the agreed system qualification.
More Information
OEM Procurement FAQ
What heat-load data is needed for an IGBT cold plate?
Provide semiconductor switching and conduction losses for the relevant operating points, their locations and the duty cycle. Inverter output power is not the same as heat dissipated into the cold plate.
Can one cold plate cool multiple IGBT modules?
A shared plate can be evaluated when module layout, heat distribution, mounting and coolant routing are defined. Flow distribution and temperature differences between modules must be checked under the specified conditions.
Which mounting details affect IGBT cooling?
Contact area, baseplate flatness, hole pattern, thermal-interface material and clamping affect the thermal path. Use the module supplier specifications and agreed assembly tolerances in the design review.
What coolant information should an OEM supply?
Specify coolant chemistry and concentration, inlet temperature, flow range, pressure-drop budget and operating pressure. Include material-compatibility and cleanliness requirements for the complete loop.
Does a metal cold plate provide electrical insulation?
Electrical insulation must not be assumed from the cold plate alone. Define the power-module insulation arrangement and any additional dielectric requirements for the assembled system.
How should IGBT cold plate performance be accepted?
Agree heat load, coolant conditions, measurement locations and temperature limits before testing. Define leak testing, pressure testing and dimensional inspection separately, with project-specific acceptance criteria.
Related guides
- IGBT heat sink selection — air-cooled vs liquid cold plate
- IGBT pin fin heat sinks — selection guide
- IGBT chip cooling — cold plate approaches
- IGBT and SiC cold plates for industrial power — inverters and drives
