Your Best IGBT cold plate
1. High Heat Transfer Coefficient: Cold plates are designed to efficiently transfer heat from electronic components to a liquid coolant, which helps in maintaining optimal operating temperatures
2. Material Compatibility: They are typically made from materials with high thermal conductivity, such as aluminum or copper, to ensure effective heat dissipation
3. Scalability: Cold plates can be adapted to various sizes and power requirements, making them suitable for a wide range of applications
4. Efficiency: These plates are highly efficient in cooling high-power electronics, which can significantly improve the performance and lifespan of the devices
5. Customizable Designs: Cold plates can be customized with different channel designs (e.g., serpentine, manifold, microchannel) to optimize the cooling performance for specific applications
IGBT cold plate Type Series
1. Efficient Heat Dissipation: Cold plates effectively transfer heat from electronic components to a liquid coolant, maintaining optimal operating temperatures, enhancing performance, and extending the lifespan of devices
2. Customized Solutions: Offering both standard and custom cold plate designs tailored to specific customer needs, ensuring optimal cooling performance
3. Reduced Energy Consumption: By providing efficient thermal management, cold plates significantly lower energy consumption and operating costs, offering an environmentally friendly cooling solution
4. Reliability and Safety: The high cooling efficiency of cold plates prevents overheating, reducing failure rates and increasing the reliability and safety of systems
5. Wide Range of Applications: Cold plates are suitable for data centers, electric vehicles, medical equipment, telecommunications, and industrial applications, meeting diverse cooling requirements
Cold plates are designed to efficiently transfer heat from electronic components to a liquid coolant, ensuring optimal operating temperatures and enhancing device performance
They can be tailored to meet specific cooling requirements, with various channel designs (e.g., serpentine, manifold, microchannel) to optimize thermal performance for different applications
Cold plates are made from materials with high thermal conductivity, such as aluminum or copper, which ensures effective heat dissipation
These cooling solutions can be adapted to various sizes and power requirements, making them suitable for a wide range of applications from small electronic devices to large industrial systems
Why choose IGBT cold plate for server cooling?
Advantages of IGBT Cold Plates for Server Cooling:
- Efficient Heat Management: Superior heat dissipation in high-density environments.
- Enhanced Cooling Performance: Maintains optimal temperatures, preventing overheating.
- Improved Reliability: Reduces thermal throttling and component failure.
- Quieter Operation: Minimizes noise compared to traditional air cooling.
- Energy Efficiency: Lowers energy consumption and operational costs.
- Extended Hardware Lifespan: Prolongs component life by maintaining safe temperatures.
IGBT cold plate Applications
Data Centers
Cold plates help in cooling high-performance servers and data storage systems, ensuring efficient operation and preventing overheating
Electric Vehicles (EVs)
They are used to cool batteries and power electronics in EVs, enhancing performance and extending the lifespan of these components
Medical Equipment
Cold plates are essential in cooling medical imaging devices, such as MRI and CT scanners, to maintain accuracy and reliability
Telecommunications
They are used in cooling telecom equipment, including base stations and network servers, to ensure uninterrupted communication services
FAQs
1. What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.
2. What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat- flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
3. What are we currently researching and developing?
We are currently researching and developing high-power, high-heat-flux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductivity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.
