Tone Cooling Technology Co., Ltd was established in 2004, specializing in custom liquid cold plate solutions for high-power, high-heat flux density chips. Headquartered in Dongguan, China, the company boasts a modern production base and an advanced R&D center. Our core technical team, with over 20 years of experience in thermal management technology, is dedicated to providing customers with high-performance, high-quality, and highly reliable liquid cold plate products.

 

Tone Cooling’s products are widely used in data center servers, graphics processing units (GPUs), power electronics (such as IGBTs), 5G communications, and the Internet of Things (IoT). We have established long-term partnerships with top brands like Intel and NVIDIA, offering customized thermal solutions to optimize their products’ performance and efficiency.

 

The company holds multiple patented technologies, including vacuum brazing, friction stir welding, and transient liquid phase diffusion bonding, ensuring optimal thermal performance, flow resistance, and sealing. Our R&D team comprises PhDs from Tsinghua University and several senior engineers with extensive experience and deep expertise in thermal management technology.

 

Tone Cooling Technology Co., Ltd is committed to becoming a global leader in thermal management technology. We aim to drive the industry towards more environmentally friendly and sustainable development through continuous technological innovation and superior product quality. In the future, we will continue to increase R&D investment, explore the application of new materials and technologies, and enhance product performance and efficiency. We will also actively expand the global market, establish broader partnerships, and provide customized thermal solutions to meet diverse customer needs. Our goal is to offer the highest quality thermal products and services to every customer, actively fulfill corporate social responsibility, protect the environment, and benefit future generations. Through our efforts, Tone Cooling will become an industry benchmark, leading the future development of thermal management technology.