Thermal Load
Heat source location, duty cycle, hot spot area, and allowable case temperature define the thermal resistance target.
Battery pack and energy storage thermal management
Custom battery cold plates for pack cooling, temperature uniformity, coolant routing, structural envelope, corrosion compatibility, and manufacturable OEM production.
Last Updated: April 8, 2026 | Reviewed by: Thermal Engineering Team, ToneCooling Technology Co., Ltd


RFQ checklist
Useful pricing needs engineering limits, not only a product name. Send drawings when available so we can review manufacturability before quotation.
Send Requirements to ToneCooling Engineering TeamQuick engineering answer
A reliable cold plate quotation starts with the thermal map, coolant conditions, flow budget, pressure drop limit, mounting interface, and envelope constraints.
ToneCooling reviews those inputs before selecting copper or aluminum, internal flow path, joining process, port design, surface flatness target, and leak test plan.
Technical inputs
Heat source location, duty cycle, hot spot area, and allowable case temperature define the thermal resistance target.
Coolant type, flow rate, pressure drop limit, and port geometry define the internal channel and manifold approach.
Mounting pattern, flatness, clamping load, surface finish, and envelope limit control contact resistance and assembly repeatability.
Copper, aluminum, plating, coolant chemistry, and mixed-metal loop risks are reviewed before production.
The sealing concept, joining method, working pressure, proof pressure, and leak acceptance criteria are confirmed during DFM.
Prototype process, batch volume, inspection plan, and cost target determine whether CNC, brazing, FSW, or tube embedding is appropriate.
Manufacturing path
The right route depends on heat flux, pressure drop, joining risk, flatness, corrosion, volume, and target cost. Final selection is confirmed during DFM review.
Suitable for prototype validation, complex interfaces, and controlled channel geometry before batch tooling.
Used for copper or aluminum structures that need sealed internal channels and repeatable thermal contact.
Useful for larger aluminum plates where weld integrity, weight, and production repeatability matter.
Cost-effective for medium heat flux zones and simple routing where pressure drop and geometry allow it.
Considered when heat flux is high and the pressure drop budget, cleaning process, and manufacturing route support it.
Balanced flow distribution, QDCs, fittings, and hose routing are reviewed as part of the system integration.
Design targets
These are not fixed promises. Typical targets depend on chip layout, coolant, flow rate, inlet temperature, pressure drop limit, and customer test method.
| Heat load | Defined by customer heat map; final value depends on application and module layout. |
|---|---|
| Coolant | DI water, water-glycol, or specified dielectric fluid; final value depends on loop chemistry. |
| Flow rate | Selected from thermal target and pump budget; final value depends on pressure drop limit. |
| Pressure drop | Controlled by channel geometry, manifold layout, and port size; final value depends on system budget. |
| Thermal resistance | Targeted from case temperature limit and heat load; final value depends on test conditions. |
| Material | Copper, aluminum, or hybrid structure; final value depends on heat flux, mass, corrosion, and cost. |
| Manufacturing process | CNC machining, vacuum brazing, FSW, tube embedding, or bonded structure; final value depends on design conditions. |
| Leak test | Proof and leak acceptance criteria are agreed during DFM; final value depends on working pressure and customer standard. |
| Surface flatness | Specified around contact interface and mounting force; final value depends on module footprint and process. |
Manufacturing capability
ToneCooling supports practical manufacturing feedback before the drawing is locked, then builds prototypes, leak-tested samples, pilot runs, and batch production according to the agreed specification.
FAQ
Yes. ToneCooling designs custom liquid cold plates around the customer heat load, coolant, flow rate, pressure drop limit, mechanical envelope, and production requirement.
Please provide heat load, coolant type, flow rate, maximum pressure drop, inlet temperature, target case temperature, mechanical envelope, mounting requirements, material preference, quantity, and drawings if available.
Copper improves heat spreading for high heat flux zones. Aluminum can reduce weight and cost when the thermal target, coolant chemistry, corrosion control, and pressure requirement allow it.
Pressure drop is controlled through channel width, path length, manifold balance, parallel flow layout, port size, and the specified flow rate.
Yes. Microchannel designs can be reviewed when the heat flux, pressure drop budget, manufacturability, cleaning process, and reliability requirements are suitable.
Yes. ToneCooling reviews sealing, port design, flatness, tolerances, leakage risk, coolant compatibility, and process selection before prototype or batch production.
Leak testing is specified around the working pressure, coolant, joining process, and customer standard. Final pressure and acceptance criteria are confirmed during DFM.
Yes. ToneCooling supports prototype builds, engineering iteration, pilot runs, and OEM batch production for custom thermal management parts.
Send drawing and thermal requirements
Share your heat load, coolant, flow rate, pressure drop limit, target temperature, envelope, mounting pattern, and drawings. Our engineering team will review the project and respond with the next practical design step.