Custom liquid cold plate manufacturer for AI servers and data centers
Custom copper liquid cold plates for GB200-class GPU thermal management, high heat flux cooling, low thermal resistance, controlled pressure drop, and OEM system integration.
RFQ checklist
To Quote Your GB200 Liquid Cold Plate, Please Provide:
- GPU / module configuration
- Heat load per chip or module
- Coolant type
- Flow rate
- Maximum pressure drop
- Inlet temperature
- Target case temperature
- Available space / envelope
- Mounting requirements
- Material preference
- Annual demand
- STEP / PDF drawings if available
Quick Engineering Answer
GB200-class AI accelerators require direct-to-chip liquid cold plates because air cooling cannot handle the combination of high heat flux, dense module packaging, and rack-level power density.
ToneCooling designs custom copper cold plates based on heat load, chip layout, coolant, flow rate, pressure drop limit, contact requirements, and the mechanical envelope required by the OEM system.
Key Design Requirements for GB200 Cold Plates
Thermal Load
Heat load per GPU or module, high heat flux areas, inlet temperature, and target case temperature define the cooling target.
Hydraulic Target
Coolant type, flow rate range, and maximum pressure drop limit guide channel and manifold design.
Interface Control
Mounting force, flatness, surface finish, TIM selection, and stack-up tolerance affect contact resistance.
Reliability
Leakage prevention, corrosion compatibility, cleaning, and coolant-material compatibility must be reviewed before production.
Recommended Cold Plate Architecture
A GB200-class cold plate is usually built around a copper base plate with a microchannel or optimized internal flow path. Depending on the geometry and production target, the structure may use vacuum brazing, diffusion bonding, or precision machining.
The design goal is not only low thermal resistance. Flow distribution, pressure drop, manufacturability, sealing, cleaning, and flatness control must be balanced together.
- Copper base plate for high heat flux areas
- Microchannel or optimized internal coolant path
- Brazed, diffusion bonded, or precision machined structure
- Balanced flow distribution across chip locations
- Controlled pressure drop within the system loop budget
Typical Design Targets / Example Engineering Targets
Typical targets depend on chip layout, coolant, flow rate, inlet temperature, and pressure drop limit. Final values must be confirmed against the customer design conditions.
| Parameter | Typical Engineering Target |
|---|---|
| Heat load | Defined by GPU or module thermal map; final value depends on customer design conditions. |
| Coolant | DI water or water-glycol; final value depends on customer design conditions. |
| Flow rate | Set by CDU and loop budget; final value depends on customer design conditions. |
| Pressure drop | Controlled by channel and manifold design; final value depends on customer design conditions. |
| Thermal resistance | Targeted according to junction/case temperature limit; final value depends on customer design conditions. |
| Material | Copper preferred for high heat flux; final value depends on customer design conditions. |
| Manufacturing process | CNC machining, vacuum brazing, diffusion bonding, or combined process; final value depends on customer design conditions. |
| Leak test | Pressure or helium leak test per specification; final value depends on customer design conditions. |
| Surface flatness | Specified by contact and mounting design; final value depends on customer design conditions. |
Manufacturing Capability
Related Liquid Cooling Resources
GB200 Liquid Cold Plate FAQ
Where does ToneCooling actually manufacture GB200 cold plates?
GB200 liquid cold plates are designed, engineered, and manufactured at our IATF 16949-aligned partner facility in Huizhou, Guangdong, China — the central manufacturing entity of ToneCooling Technology Co., Ltd (founded 2004, ISO 9001 certified, annual capacity 1,000,000+ plates). Customer-facing engineering support is provided through three regional entities: ToneCooling Technology Co., Ltd globally, ToneCooling Texas LLC for North American customers (Austin, Texas), and ToneCooling Australia Pty Ltd for Australian and New Zealand customers (Carlton, Victoria; ABN 96 653 174 040). Customers contract with the regional entity that matches their commercial preference.
Can U.S. customers work with ToneCooling Texas LLC instead of the China entity?
Yes. ToneCooling Texas LLC (Austin, Texas, United States) is the U.S. customer-facing entity. American AI server, hyperscale data centre, EV, and power electronics OEM customers can engage Texas LLC directly for RFQ intake, NDA execution, AUD/USD quotation, ChAFTA/USMCA documentation, and project coordination. The Texas team coordinates GB200 cold plate design, engineering, and manufacturing with the Huizhou facility under a single project owner. U.S. customers do not need to engage the China entity directly.
Can Australian customers work with ToneCooling Australia Pty Ltd?
Yes. ToneCooling Australia Pty Ltd (Suite 69, 139 Cardigan Street, Carlton VIC 3053, Australia; ABN 96 653 174 040) is the Australian customer-facing entity. AU and NZ customers engage Carlton VIC for RFQ intake, AS/NZS compliance documentation (AS/NZS 5139, AS/NZS 4777.2, AS/NZS 60068-2-14), ChAFTA Certificate of Origin, AUD quotation, and project handover.
Does the GB200 cold plate ship from China or USA?
Standard production cold plates ship from the Huizhou manufacturing facility (origin: China; HS 8419 typically). Texas LLC and Australia Pty Ltd handle the customer-side commercial relationship, documentation, and engineering support — they do not separately manufacture. ChAFTA Certificate of Origin is supplied for AU shipments to reduce import duty; CBP-compliant commercial invoice and packing list are supplied for U.S. shipments.
Can ToneCooling design a custom GB200 liquid cold plate?
Yes. ToneCooling designs custom copper liquid cold plates for GB200-class AI server cooling based on module layout, heat load, coolant, flow rate, pressure drop limit, mounting envelope, and OEM integration requirements.
What information is needed for a GB200 cold plate quote?
Please provide GPU or module configuration, heat load, coolant type, flow rate, maximum pressure drop, inlet temperature, target case temperature, mechanical envelope, mounting requirements, material preference, annual demand, and STEP or PDF drawings if available.
Copper or aluminum, which is better for GB200 cooling?
Copper is usually preferred for high heat flux GPU cold plates because of its higher thermal conductivity. Aluminum may be considered when weight, cost, coolant chemistry, and corrosion compatibility allow it.
How do you control pressure drop?
Pressure drop is managed by internal channel geometry, manifold design, parallel flow distribution, coolant path length, port sizing, and target flow rate.
Can you support microchannel cold plate design?
Yes. ToneCooling can support microchannel and optimized internal flow path designs when the heat flux, pressure drop target, manufacturability, and cleaning requirements are suitable.
Do you provide DFM review before production?
Yes. ToneCooling can review drawings for manufacturability, sealing approach, port design, flatness, tolerance stack-up, leakage risk, and process selection before prototype or batch production.
What leak testing is performed?
Cold plates can be leak tested according to the agreed customer requirement and manufacturing process. The final method and acceptance limit depend on the application, coolant, working pressure, and customer specification.
Can you support prototype and mass production?
Yes. ToneCooling supports prototype builds, DFM iterations, pilot runs, and batch production for custom liquid cold plates.
Send your project for review
To Quote Your GB200 Liquid Cold Plate, Please Provide:
Upload your drawing, thermal load, coolant, flow rate, and pressure drop target. ToneCooling engineering will review the design conditions before quoting.
- GPU / module configuration
- Heat load per chip or module
- Coolant type and flow rate
- Maximum pressure drop and inlet temperature
- Target case temperature and available envelope
- Mounting, material, annual demand, STEP / PDF drawings
