Guangdong, China
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liquid cold plates Australia for optical modules and AI data centers
ToneCooling Optical Module Liquid Cooling Plate thermal management
liquid cold plates Australia for optical modules and AI data centers
ToneCooling Optical Module Liquid Cooling Plate thermal management

Co-Packaged Optics (CPO) Liquid Cooling Cold Plate | ToneCooling

designed for next-generation 800G, 1.6T, and beyond optical transceivers. By utilizing efficient micro-channel design and superior thermal conductive materials, it directly attaches to the optical module, rapidly dissipating heat and preventing performance degradation.

This crucial component ensures signal integrity, extends module lifespan, and enables higher power density in advanced applications like data centers, AI clusters, and telecommunications infrastructure. It is the definitive answer to the thermal challenges of modern high-speed connectivity.

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Optical Module Liquid Cooling Plate Description

  • Precision Cooling: Targets the hottest components directly, enabling higher power densities.

  • Enhanced Reliability: Maintains optimal junction temperature, significantly extending optical module lifespan.

  • Compact Design: Ideal for high-density applications without compromising space.

  • Custom Solutions: Tailored designs available to meet your specific thermal and mechanical requirements.

Optical Module Liquid Cooling Plate Technical

Name: Optical Module Liquid Cooling PlateHeat Source: 4015mm Optical ModuleHeat Dissipation:25W16=400WMaterials: Cold plate -copper, liquid distributor -stainless steelProcess: Company’s patented technology -ultrasonic weldingWorking Fluid: PG25Overall Dimensions:1068012.9mm (for 4 optical modules, the lengthchanges according to the number of optical modules)Pressure Drop Requirement: Less than 25KPa, designed to be 7.9KPaFlow Rate: 1.2L/min
Water Supply Temperature: 40°C
Flow Resistance:< 25KPaOperating Temperature:5’c-70°CSurface Treatment: The thickness of the chemical nickel film layer on thecold plate is 3-7um
Application Field: Heat dissipation of server optical modules

Application Fields of Optical Module Liquid Cooling Plates

1. Next-Generation Data Centers & Cloud Computing

  • Application: Cooling 800G, 1.6T, and future Terabit-scale optical modules within spine-leaf switches and core routers.

  • Why it’s critical: The power consumption of advanced optical modules is outpacing the capabilities of traditional air cooling. Liquid cooling plates are essential for maintaining signal integrity, reducing bit error rates (BER), and achieving Power Usage Effectiveness (PUE) targets in hyper-scale and colocation data centers.

2. High-Performance Computing (HPC) & Artificial Intelligence (AI) Clusters

  • Application: Thermal management for optical modules facilitating high-speed interconnects (e.g., NVLink, Infinity Fabric) between GPUs and compute nodes.

  • Why it’s critical: AI training and complex scientific modeling require massive, uninterrupted data flow. Liquid cooling plates prevent thermal throttling of optical transceivers, ensuring minimal latency and maximum computational throughput in these multi-million-dollar systems.

3. Telecommunications & 5G/6G Infrastructure

  • Application: Deployed in core network gateways, baseband units (BBUs), and future 6G fronthaul/backhaul equipment.

  • Why it’s critical: As telecom networks evolve to support higher bandwidth and lower latency, the optical hardware at their core generates more heat. Liquid cooling provides the reliable, dense thermal management needed for 24/7 network operation and resilience.

Co-packaged optics (CPO) liquid cooling

Co-Packaged Optics Liquid Cooling Cold Plate
High-Channel-Density Copper Cold Plate for CPO & Near-Package Optics

Copper liquid cold plate engineered for high-channel-density optical engines in co-packaged optics (CPO) and near-package optics architectures — where multiple optical channels sit close to the switch ASIC and conventional single-module cold plates no longer fit the layout. Ultrasonically welded, tested at 25 W per channel across 16 channels (400 W total).

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25 W × 16 chRated heat load (400 W total)
Copper / Ultrasonic weldMaterial · joining
1.2 LPM / 7.9 kPaFlow · pressure drop
≤52°CSurface temp @40°C inlet
ToneCooling high-channel-density copper cold plate for co-packaged optics

Why CPO and near-package optics need a different cold plate

As switch fabrics move from pluggable QSFP-DD/OSFP transceivers toward co-packaged optics, the optical engines move from the faceplate onto (or immediately beside) the switch substrate. Per-module power still runs in the tens of watts, but many channels now sit in a single dense cluster instead of one plate per pluggable module — so the cold plate has to spread heat evenly across a wide, thin, multi-channel footprint rather than cool one module at a time. Industry analysis puts 1.6T-class optical channel power above 30 W as speeds move past 800G, which is pushing the CPO thermal design problem past what air cooling or single-module plates can handle.

Key specifications

ModelT-HS202331 — ToneCooling optical module liquid cold plate
ApplicationCo-packaged optics (CPO) and near-package optics, high-channel-density optical engines
Heat dissipation25 W per channel × 16 channels (400 W total)
MaterialCopper
Joining methodUltrasonic welding (thin-plate construction)
Test conditions25% PGW coolant, 40°C inlet temperature
Flow rate / pressure drop1.2 LPM at 7.9 kPa
Cold plate surface temperature≤52°C
Working pressure0.6 MPa
Dimensions416 × 122 × 8 mm
CAD / drawingsSTEP model and 2D drawing available under NDA — request with your RFQ
ValidationCFD flow and thermal simulation; helium leak and proof-pressure testing
ISO 9001RoHSCFD validated before toolingHelium leak testedMOQ 5 pcsPrototype 7–15 days

Why ToneCooling

The thin, wide 416 × 122 × 8 mm envelope and ultrasonic-welded copper construction were developed for exactly this kind of dense, multi-channel optical footprint — the same plate family that cools 16 channels across a linear card edge adapts to CPO and near-package layouts where several optical engines cluster around the switch ASIC. Design, engineering, and manufacturing run in-house at the ToneCooling technical center in Guangdong, with CFD simulation and helium leak testing on every unit before it ships.

Applications

Co-packaged optics (CPO) switch platforms, near-package optical engines, and other high-channel-density optical interconnect designs at 400G, 800G, and emerging 1.6T port speeds where multiple optical channels must be cooled as one dense cluster rather than one module at a time.

CPO & Optical Module Liquid Cooling Cold Plate FAQ

Is this the same physical plate as ToneCooling’s pluggable optical module cold plate?
It is the same manufacturing platform — thin ultrasonically-welded copper, 25 W-per-channel rated — configured for the dense, multi-channel layout that CPO and near-package optics need. For a single pluggable QSFP-DD/OSFP module footprint, see the standard optical module liquid cold plate page.

What channel power does this plate support?
Rated at 25 W per channel across 16 channels (400 W total) at the tested condition: 25% PGW coolant, 40°C inlet, 1.2 LPM flow, surface temperature held at or below 52°C.

Can the channel count or layout be customized?
Yes. Channel count, pitch, port location, and the overall footprint are customized from your optical engine or line-card drawing, with CFD simulation validating the design before tooling.

What coolant should be used?
Rated performance is tested with 25% PGW at 40°C inlet. Alternative coolant chemistries are reviewed during DFM against your loop design.

What is the MOQ and lead time?
Prototype MOQ is 5 pieces with a 7–15 business day lead time from approved drawing and PO; production runs 4–6 weeks.

How is quality verified before shipment?
Helium leak testing and proof-pressure testing on the production line, plus flatness and dimensional checks to the acceptance criteria agreed in writing before quotation.

Request a quote

Send your optical engine or line-card drawing, channel count and power, coolant, and flow budget to info@tonecooling.com or use the quote form — the engineering team returns a manufacturable concept with the quotation. MOQ 5 pcs, prototype in 7–15 business days.

Send drawings for engineering review

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

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