mos cold plate
1. High Thermal Performance: MOS cold plates are designed to provide efficient heat transfer, ensuring that electronic components remain within optimal temperature ranges
2. Mini-Channel Fin Design: This design enhances the surface area for heat transfer, maximizing cooling efficiency while maintaining a low pressure drop
3. Material Compatibility: These cold plates are compatible with industry-standard coolants, ensuring versatility and reliability in various applications
4. Lightweight Construction: The lightweight design of MOS cold plates makes them easy to handle and install, which is particularly beneficial in applications where weight is a critical factor
mos cold plate Series
1.Enhanced Performance: MOS cold plates provide efficient heat dissipation, ensuring electronic components operate within optimal temperature ranges. This enhances the performance and reliability of the devices
2. Custom Solutions: Offering both standard and custom designs, MOS cold plates can be tailored to meet specific cooling requirements, providing optimal thermal management for various applications
3. Energy Efficiency: By effectively managing heat, MOS cold plates help reduce energy consumption and operating costs, contributing to a more sustainable and cost-effective solution
4. Increased Reliability and Safety: Efficient cooling prevents overheating, reduces failure rates, and increases the overall reliability and safety of electronic systems
MOS cold plates are designed to provide efficient heat transfer, ensuring that electronic components remain within optimal temperature ranges
These cold plates can be tailored to meet specific cooling requirements, with various channel designs (e.g., serpentine, manifold, microchannel) to optimize thermal performance for different applications
Made from materials with high thermal conductivity, such as aluminum or copper, MOS cold plates ensure effective heat dissipation
They can be adapted to various sizes and power requirements, making them suitable for a wide range of applications from small electronic devices to large industrial systems
Why choose CPU&GPU liquid cold plate for server cooling?
Advantages of CPU & GPU Liquid Cold Plates for Server Cooling:
- Efficient Heat Management: Superior heat dissipation in high-density environments.
- Enhanced Cooling Performance: Maintains optimal temperatures, preventing overheating.
- Improved Reliability: Reduces thermal throttling and component failure.
- Quieter Operation: Minimizes noise compared to traditional air cooling.
- Energy Efficiency: Lowers energy consumption and operational costs.
- Extended Hardware Lifespan: Prolongs component life by maintaining safe temperatures.
mos cold plate Applications

Electric Vehicles (EVs)
MOS cold plates are used to cool batteries, power electronics, and other critical components in electric vehicles, enhancing performance and extending their lifespan

Data Centers
They help in cooling high-performance servers and data storage systems, ensuring efficient operation and preventing overheating

Medical Equipment
Cold plates are essential in cooling medical imaging devices, such as MRI and CT scanners, to maintain accuracy and reliability

Telecommunications
Used in cooling telecom equipment, including base stations and network servers, to ensure uninterrupted communication services
FAQs
1. What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.
2. What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat- flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
3. What are we currently researching and developing?
We are currently researching and developing high-power, high-heat-flux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductivity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.