GB200 GPU cold plate performance is not just about temperature—it must be predictable under your real coolant, flow, and ΔP budget. This page shares a reference GB200 GPU cold plate build, typical boundary conditions, and what procurement and thermal engineers usually ask before releasing a PO.
Need a manufacturable quote or drawing package?
Send your interface drawing + boundary conditions here: Cold Plate RFQ
Fastest contact: WhatsApp +61 449 963 668 | Email sales@tonecooling.com
GB200 GPU cold plate reference snapshot (what you can benchmark)
- Heat load: 1200W + 1200W + 300W (reference)
- Material: T2 copper (high-purity copper)
- Joining / sealing: nitrogen-protected brazing + laser welding
- Working condition (reference): 25±2°C inlet, 2.5 L/min, pure water
- Flow resistance (ΔP): 35±5 kPa (reference condition)
- Pressure capability: 0.6 MPa
- Cold plate surface temperature: < 43°C (reference condition)
- Envelope (reference): 235 mm × 190 mm × 30 mm
Note: “Reference” values are for technical context. Final performance depends on your interface flatness, TIM stack, coolant mixture, inlet temperature, flow, and ΔP limit.
Where this GB200 GPU cold plate design fits
- Direct-to-chip liquid cooling loops for high-power GPU platforms
- Engineering validation builds where thermal repeatability and hydraulic stability matter
- Programs that must hold a strict ΔP budget to avoid starving parallel branches
Integration notes (ports, hoses, and quick disconnects)
Many data center loops use hoses and quick disconnects (QDC) to simplify service. If your program has a defined fitting/QDC standard, send it in the RFQ so we can keep routing and port constraints manufacturable.
- QDC / manifold guidance: Quick Disconnects (QDC) & Manifolds
- Leak/pressure verification options: Leak Tightness & Pressure Testing
How to protect your ΔP budget (why “ΔP-first” quoting saves time)
Your GB200 GPU cold plate must meet thermal targets without exceeding the loop’s ΔP ceiling. If ΔP is not specified, quoting becomes guesswork and iterations multiply.
Use this guide when your system has strict flow balancing requirements:
Cold Plate ΔP Budget Guide
RFQ inputs (procurement-ready checklist)
To get a manufacturable quote quickly, include:
- Interface drawing (STEP/PDF) + mounting stack details
- Heat load + heat map (or hotspot assumptions)
- Coolant and concentration (DI / EGW / PGW), inhibitor expectations
- Inlet temperature, flow rate, and ΔP limit
- Pressure target (working / proof) and any leak criteria
- Volume plan: prototype → pilot → production
Input helper page: Design Input Checklist
CTA: Request 2D + 3D drawings (PDF + STEP)
If you want to evaluate envelope, port layout, or mounting details, request the GB200 GPU cold plate drawing package:
- Request 2D (PDF) + 3D (STEP) drawings — mention “GB200 GPU cold plate drawing package”
- Or email: sales@tonecooling.com (attach NDA if required)
Typical prototype MOQ: 5 pcs | Prototype lead time: 4–6 weeks | Engineering response: 1–3 business days (with complete inputs)
FAQ — GB200 GPU cold plate
Q1: Can you match our coolant (EGW/PGW) instead of pure water?
A: Yes. Share concentration, inhibitor expectations, and inlet temperature. We align material/finish and validation accordingly. See: Coolant Compatibility
Q2: We have a strict ΔP limit—can you design to it?
A: Yes. ΔP is treated as a primary design constraint; internal channels and porting are tuned to balance thermal performance and hydraulic limits.
Q3: Do you support QDC standards and hose routing constraints?
A: Yes. Provide your QDC/fitting standard and envelope constraints in the RFQ.
Q4: What test evidence can you provide?
A: Options include leak verification, pressure capability checks, and flow/ΔP verification at your boundary conditions (per project requirement).
External references
Trademark Notice
NVIDIA is a trademark of its respective owner. This page describes compatibility/reference builds only. ToneCooling is not affiliated with or endorsed by NVIDIA.
