High-Power Chip Liquid Cooling Plates China Manufacturer
Dongji Cooling Technology is committed to the development, production and sales of high-power chip liquid cooling plates. The core technical team has more than 20 years of experience in cooling research and development.

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Our products are widely used in industrial automation, telecommunications, electric power and other fields. Energy, semiconductors, medical equipment, transportation, consumer electronics, etc.

About Tone
Tone Cooling Technology Co., Ltd was established in 2004, specializing in custom liquid cold plate solutions for high-power, high-heat flux density chips. Headquartered in Dongguan, China, the company boasts a modern production base and an advanced R&D center. Our core technical team, with over 20 years of experience in thermal management technology, is dedicated to providing customers with high-performance, high-quality, and highly reliable liquid cold plate products.
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Our company is dedicated to the development of cooling technology for high-power, high-heat-flux density chips, especially in liquid cooling and phase-change cooling technology. Led by a PhD from Tsinghua University, our team members are engineers with many years of industry experi-ence and from internationally renowned cooling companies.
Our company is located in Dongkeng Town, Dongguan City, Guangdong Province, an economically developed area with a concentrated industrial base.
We have obtained 2 invention patents, 6 utility model patents, and passed the ISO9001 system certification, receiving praise from more than 10 customers.
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and loT industries.
We can design and manufacture liquid cooling plates for high-power, high-heat-flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
We are currently researching and developing high-power, high-heat-lux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.