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IGBT / PCS Liquid Cold Plate Design Notes (CTQ-First)
An IGBT liquid cold plate is typically assembly-driven: hole pitch, flatness, sealing zones, and port reliability decide yield.
Thermal performance must be met inside the system ΔP budget, with repeatable production capability. Use the inputs, CTQs, and validation checklist below.
Required inputs table
| Input | Why it matters | Recommended note |
|---|---|---|
| Module footprint + mounting | Datums and hole CTQs | Clamp/load limits and keep-out |
| Loss map | Hotspot and spreading needs | Peak/average profile |
| Coolant + inlet temp | Viscosity drives ΔP | PG% and temperature window |
| Flow + allowable ΔP | Channel design window | ΔP budget at nominal flow |
| Leak requirement | Joining/sealing CTQs | Method + pressure + acceptance |
CTQs (power electronics focus)
- Flatness: post-process flatness target + measurement method.
- Hole pitch/position: GD&T tied to functional datums.
- Sealing zone: groove geometry + Ra.
- Ports: thread standard, chamfer, torque window, protection.
- Leak: defined window + traceability.
Validation checklist
- FAI/CMM: datums, hole position, flatness, sealing groove.
- Leak record: method, pressure, duration, measured result.
- ΔP–flow characterization (multi-point) under representative coolant.
- Thermal mapping under representative loss profile and clamp loads.
- Coolant compatibility check if chemistry varies or is uncertain.
Related internal links
External references (outbound links)
- IEC 62477-1 — Converter systems safety requirements
- IEC 61800-5-1 — Adjustable speed drive safety
- ASME Y14.5 — GD&T reference
FAQ
Why is flatness critical for PCS/IGBT cooling?
Interface contact resistance can dominate; warpage creates gaps and raises junction temperature.
What is the most common assembly issue?
Hole pitch/datum mismatch and uneven clamp loading changing TIM thickness.
Is higher flow always better?
Not always—flow may exceed ΔP budget and reduce pump efficiency; optimize at system level.
Do we need electrical isolation considerations?
If required, define isolation spec early because it affects materials and stack-up.
Which leak test should be used?
Pressure decay is common for screening; choose sensitivity based on acceptance limit and risk.
Should we request a ΔP–flow report?
Yes for tight loop budgets or parallel systems; it reduces integration risk.
What should be written on drawing notes?
Datums, hole CTQs, sealing Ra, leak window, flatness target, and inspection plan.
What deliverables are typical?
Leak record, FAI/CMM CTQ report, and optional ΔP–flow report.
