H200 GPU cold plate selection is usually constrained by three things: thermal repeatability, loop ΔP budget, and leak/pressure risk across service events. This page documents a reference H200 GPU cold plate build (GPU + switch) and what to specify to receive a manufacturable quotation.
Request quote or drawings: Cold Plate RFQ
Fastest contact: WhatsApp +61 449 963 668 | Email sales@tonecooling.com
H200 GPU cold plate reference snapshot
- Heat load (reference): 8×700W + 2×134W + 2×156W
- Material: T2 copper
- Joining / sealing: continuous nitrogen-protected brazing (tunnel furnace)
- Working condition (reference): 38°C inlet, 8.0 LPM, pure water
- Flow resistance (ΔP): ~18.5 kPa (reference, tolerance per program)
- Pressure capability: 0.8 MPa
- Cold plate surface temperature: < 65°C (reference condition)
- Envelope (reference): GPU 151 mm × 78.2 mm × 43.14 mm; Switch 80 mm × 64.3 mm × 7.6 mm
Why this matters to procurement & thermal engineers
- Predictable ΔP at design flow so manifold balancing does not drift
- Leak-tight sealing across thermal cycling and maintenance events
- Clear test evidence aligned to your acceptance criteria
- Manufacturability from 5 pcs prototype to volume ramps
Integration notes (GPU + switch, porting, and serviceability)
GPU + switch assemblies often impose tight keep-out zones and routing constraints. If your platform specifies hose bend radius, QDC standard, or manifold interface, include it in your RFQ so the first quote is manufacturable.
- QDC/manifold notes: Quick Disconnects (QDC) & Manifolds
- Leak/pressure options: Leak Tightness & Pressure Testing
ΔP budget guidance for H200 GPU cold plate loops
For an H200 GPU cold plate, meeting temperature targets is meaningless if ΔP exceeds the loop allowance and starves other branches. Specify ΔP limit early to avoid rework:
RFQ inputs (fast path to a manufacturable quote)
- Interface drawing (STEP/PDF) + mounting stack details
- Heat map / hotspots and allowable cold-plate surface temperature
- Coolant chemistry and concentration (DI / EGW / PGW) + inhibitor expectations
- Inlet temperature, target outlet temperature, flow rate, and ΔP limit
- Pressure target (working/proof) + leak requirement
- Prototype quantity and volume plan
CTA: Download / request 2D + 3D drawings (PDF + STEP)
To evaluate fit, keep-out zones, and routing, request the H200 GPU cold plate drawing package:
- Request 2D (PDF) + 3D (STEP) drawings — mention “H200 GPU + switch drawing package”
- Or email: sales@tonecooling.com
Typical prototype MOQ: 5 pcs | Prototype lead time: 4–6 weeks | Engineering response: 1–3 business days (with complete inputs)
FAQ — H200 GPU cold plate
Q1: Can you tune the cold plate to our ΔP limit?
A: Yes. Share your flow and ΔP limit; we tune channel geometry and porting to fit hydraulic constraints.
Q2: Can we use EGW/PGW instead of pure water?
A: Yes. Provide concentration and inhibitor expectations. See: Coolant Compatibility
Q3: Do you support QDC standards?
A: Yes. Provide your QDC/fitting model family or interface requirements.
Q4: What verification options are available?
A: Leak verification, pressure capability checks, and flow/ΔP verification at your boundary conditions (per program).
External references
Trademark Notice
NVIDIA is a trademark of its respective owner. This page describes compatibility/reference builds only. ToneCooling is not affiliated with or endorsed by NVIDIA.
