NVIDIA H200 Liquid Cooling Plate – HGX H200 Direct-to-Chip Cold Plate Kit

The NVIDIA H200 liquid cooling plate from ToneCooling is a T2 purple copper direct-to-chip cold plate purpose built for the NVIDIA Hopper H200 GPU, HGX H200 8-GPU baseboards, and SXM5 modules. This H200 GPU cold plate is a precision copper heat exchanger that mounts directly on the H200 package and removes up to 700 W per GPU – a complete HGX H200 kit dissipates 8 x 700 W + 2 x 134 W + 2 x 156 W = 6180 W per baseboard into a single-phase liquid loop, replacing the air-cooled heatsinks that can no longer keep up with Hopper class AI training workloads. We manufacture this NVIDIA H200 cold plate in our ISO 9001:2015 certified facility using a continuous nitrogen-protection brazing tunnel furnace, ship prototypes at MOQ 5 pcs in 7-15 business days, and support OEM customisation of port location, manifold integration, and surface finish.

What Is an NVIDIA H200 Liquid Cooling Plate?

Direct answer: A NVIDIA H200 liquid cooling plate is a T2 purple copper direct-to-chip (DTC) cold plate that bolts on top of an NVIDIA H200 GPU and removes heat by circulating liquid coolant through internal micro-channels, delivering 3 – 5x the heat transfer of an equivalent air cooler.

NVIDIA’s H200 is the memory-upgraded Hopper GPU introduced for large-language-model inference and training, shipping with 141 GB of HBM3e memory and a ~700 W thermal envelope in the SXM5 form factor. At that power density an air-cooled HGX baseboard requires > 35 CFM per GPU – impractical in 80+ kW racks. A dedicated NVIDIA H200 cold plate solves this by evacuating heat directly from the GPU package into a facility water loop running per ASHRAE TC 9.9 W45/W55 datacom guidelines. ToneCooling’s plate mates to either single-GPU SXM5 sockets or complete HGX H200 8-GPU boards, and scales from prototype evaluation kits to full production NVL deployments compatible with NVIDIA’s HGX H200 reference designs.

H200 Cold Plate Specifications (Datasheet)

Direct answer: ToneCooling’s H200 cold plate is a nitrogen tunnel-brazed T2 purple copper assembly rated 700 W per GPU at 38 C pure-water inlet and 8.0 L/min, with a total HGX-level heat dissipation of 6180 W per baseboard.

How Does the H200 Cold Plate Improve GPU Performance?

Direct answer: By holding the H200 cold plate surface below 65 C at a 38 C pure-water inlet and 8.0 L/min, the liquid cooling plate keeps the GPU junction out of thermal throttling, recovering 8 – 12 % of sustained training throughput relative to an air-cooled SXM5 platform.

In a ToneCooling internal validation run we measured a complete HGX H200 baseboard using the cold plate shown above at a 38 C facility-water inlet and 8.0 L/min per GPU (pure water). CFD simulation and bench measurement both confirmed the cold plate surface held below 65 C while the full baseboard dissipated the rated 6180 W (8 x 700 W GPU + 2 x 134 W + 2 x 156 W NVSwitch). That is well below the ~90 C throttle point of the Hopper architecture, which directly maps to longer GPU boost clock residency and measurable gains in tokens-per-second on Llama-3 70B inference workloads. Because the H200 cold plate assembly also removes heat from every NVSwitch on the baseboard, the whole HGX unit stays inside the ASHRAE W45 envelope even at 80 kW rack power.

H200 HGX Rack Integration and OEM Customisation

Direct answer: ToneCooling supplies matched cold plates, manifolds, and dripless quick disconnects for HGX H200 baseboards, and co-engineers the complete rack loop with hyperscale OEMs via CFD before tooling.

Every HGX H200 cold plate kit we ship includes CFD-validated flow distribution across all 8 GPUs and both NVSwitch pairs, a bench-tested flow-resistance curve at 8.0 L/min, and PPAP documentation for OEM qualification. We support three common rack architectures: (1) rear-door heat exchanger retrofit, (2) in-row CDU loops, and (3) direct facility-water plumbing to an external dry cooler. Customisation options include port position, manifold geometry, electroless nickel plating for mixed-metal loops, and integrated temperature/flow instrumentation. The GPU cold plate measures 151 x 78.2 x 43.14 mm and each NVSwitch cold plate measures 80 x 64.3 x 7.6 mm, allowing retrofit into standard HGX chassis envelopes without mechanical interference.

Frequently Asked Questions About the H200 Cold Plate

Is this H200 cold plate compatible with the HGX H200 8-GPU baseboard?

Yes. The NVIDIA H200 liquid cooling plate is engineered for both single SXM5 sockets and complete HGX H200 8-GPU baseboards, and it is supplied with matched NVSwitch cold plates (80 x 64.3 x 7.6 mm) for full-baseboard direct-to-chip cooling. Total rated heat dissipation is 6180 W per HGX baseboard.

What flow rate and pressure drop should I design the CDU loop for?

Design the secondary loop for 8.0 L/min per GPU cold plate with pure water. At that operating point our H200 cold plate has a measured flow resistance of 18.5 kPa +/- 20 %. The cold plate is rated for 0.8 MPa (8 bar) working pressure and helium leak tested before shipping.

What thermal performance can I expect on a 700 W H200 SXM5?

At the rated 38 C pure-water inlet and 8.0 L/min per GPU, the ToneCooling H200 cold plate holds its surface temperature below 65 C while dissipating the full 700 W per GPU (and 134 – 156 W per NVSwitch), well below the 90 C throttle point and sufficient for full H200 boost clock residency under Llama-3 class inference loads.

What material and brazing process do you use for the H200 cold plate?

Every ToneCooling H200 cold plate is built from T2 purple copper (oxygen-free high-conductivity grade, ~391 W/m.K) and joined in a continuous nitrogen protection brazing tunnel furnace. Nitrogen atmosphere tunnel brazing eliminates oxide formation at the fin-to-base interface, producing a metallurgically bonded joint with lower thermal resistance and higher thermal cycling durability than epoxy-bonded or solder-bonded plates.

Do you support OEM PPAP qualification for HGX H200 cold plates?

Yes. ToneCooling ships PPAP Level 3 documentation including material certificates for the T2 copper, helium leak test records, hydrostatic burst test data, and CFD validation reports, aligned with hyperscale and automotive OEM qualification processes. Prototype MOQ is 5 pcs with a 7 – 15 business day lead time.

Lead Time, MOQ, and Pricing for the H200 Cold Plate

• Prototype: MOQ 5 pcs, 7 – 15 business days from confirmed drawing
• Production: MOQ 50 pcs, 4 – 6 weeks depending on volume
• Indicative pricing: USD 700 – 1800 per unit at production volume; prototype quote within one business day
• Documentation: Free CFD review, flow-resistance curve, and T2 copper material certificates included
• Shipping: Worldwide air freight from Shenzhen, full export documentation for US and EU customs

For complementary platforms, see our liquid cold plate catalogue, our NVIDIA GB200 liquid cooling plate, and our dedicated CPU cold plate range. If you need a quote for the NVIDIA H200 liquid cooling plate or a custom HGX H200 manifold kit, request a quote and our thermal engineering team will respond within one business day.

Author: ToneCooling Engineering Team (Thermal Engineer). Last Updated: 2026-04-10.