ToneCooling T-HS202324 NVIDIA gb200 superchip liquid cold plate, product view

NVIDIA GB200 Superchip Liquid Cold Plate | T-HS202324

Integrated copper cold plate module for the NVIDIA GB200 Grace Blackwell Superchip — two Blackwell GPUs and the Grace CPU cooled by one assembly, 152.9 × 194 × 31 mm. Removes 3.2 kW with pure water at 4.4 LPM / 30 kPa and 25 °C inlet, holding contact surfaces below 55 °C. Rated 0.6 MPa for tray-level manifold systems.

1500 W × 2 + 200 W at < 55 °C surface with 25 °C inlet — 30 K case-to-inlet rise on pure water
30 kPa at 4.4 LPM — sized for a dedicated CDU branch at the rated flow
152.9 × 194 × 31 mm — 31 mm profile; port position to your chassis layout
TLP-bonded copper, 0.6 MPa rated — every unit leak-tested before shipment

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Download Datasheet (PDF)T-HS202324 · Rev. A · Sept 2026

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: 30 K case-to-inlet rise at rated load, measured at the contact area with pure water. Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 30 kPa at 4.4 LPM — sized for a dedicated CDU branch at the rated flow; validated on our flow bench at the rated inlet temperature of 25 °C.
Mechanical: 152.9 × 194 × 31 mm copper plate, 31 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
Construction: TLP – Transient Liquid-Phase Diffusion Bonding — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 0.6 MPa working pressure, 100% pressure-tested.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202324 Specifications (as tested)

Parameter	Value
Model	T-HS202324
Target device	NVIDIA GB200 Superchip
Rated heat load	1500 W × 2 + 200 W
Coolant (as tested)	Pure water
Inlet coolant temperature	25 °C
Max. plate surface temperature	< 55 °C
Case-to-inlet thermal resistance	≈ 0.0094 °C/W (assembly, from rated point)
Flow rate / pressure drop	4.4 LPM / 30 kPa
Working pressure rating	0.6 MPa
Dimensions (L × W × H)	152.9 × 194 × 31 mm
Base material	Copper
Bonding process	TLP – Transient Liquid-Phase Diffusion Bonding
Leak test	100% pressure-tested before shipment

Typical applications

GB200 NVL72 / NVL36 compute trays
Next-generation AI factory racks
OEM / ODM liquid-cooled server platforms

Ordering & RFQ

How to order: quote model T-HS202324 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 25 °C inlet with pure water. Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

NVIDIA and the GPU model names are trademarks of NVIDIA Corporation. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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