ToneCooling NVIDIA GB200 liquid cold plate, product view

NVIDIA GB200 Liquid Cold Plate Kit | TC-BZP-GB200-01A

The ToneCooling GB200 cold plate kit (TC-BZP-GB200-01A) is a purple-copper T2 direct-to-chip liquid cold plate assembly that cools both Blackwell GPUs and the Grace CPU of one NVIDIA GB200 Superchip; rack-level needs are covered in GB200 NVL72 cooling requirements.

Purple-copper T2 direct-to-chip cold plate kit for the NVIDIA GB200 Grace Blackwell Superchip — two Blackwell GPUs and the Grace CPU, 235 × 190 × 30 mm. Datasheet reference point: 1200 W + 1200 W + 300 W with 25 ± 2 °C pure water at 2.5 L/min and 35 ± 5 kPa, cold-plate surface below 43 °C. Rated 0.6 MPa; nitrogen-protection brazed and laser welded.

1200 W + 1200 W + 300 W at < 43 °C surface with 25 ± 2 °C pure water inlet (datasheet reference point)
35 ± 5 kPa at 2.5 L/min — flow resistance at the datasheet reference flow
235 × 190 × 30 mm — cold-plate envelope; kit includes manifold, stainless bellows and quick disconnects
Brazed and laser-welded T2 copper, 0.6 MPa rated — 100% leak tested (helium or pressure test, criteria per project)

Get A Free Quote

Download Datasheet (PDF)TC-BZP-GB200-01A · Rev. A · June 2026

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: cold-plate surface below 43 °C at 1200 W + 1200 W + 300 W with 25 ± 2 °C pure water at 2.5 L/min; thermal resistance is CFD-validated per project. Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 35 ± 5 kPa flow resistance at 2.5 L/min with pure water (inhibited EGW also supported); NVQD quick disconnect.
Mechanical: 235 × 190 × 30 mm purple-copper T2 cold plates with manifold, stainless bellows, barb fittings and spring-screw mounting. Mounting pattern matches the target device; custom port orientation and fittings on request.
Construction: nitrogen-protection brazing plus laser welding; 0.6 MPa maximum operating pressure; 100% leak tested; bonded joints inspected by ultrasonic C-scan per ASTM E2375.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

TC-BZP-GB200-01A Specifications (datasheet)

Parameter	Value
Model	TC-BZP-GB200-01A
Target device	NVIDIA GB200 Superchip
Rated heat load	1200 W + 1200 W + 300 W (2× GPU + CPU)
Coolant (as tested)	Pure water
Inlet coolant temperature	25 ± 2 °C
Max. plate surface temperature	< 43 °C
Thermal resistance	CFD-validated per project
Flow rate / pressure drop	2.5 L/min / 35 ± 5 kPa
Working pressure rating	0.6 MPa
Dimensions (L × W × H)	235 × 190 × 30 mm
Base material	Purple copper T2
Joining process	Nitrogen-protection brazing + laser welding
Leak test	100% (helium or pressure test, criteria per project)

Typical applications

GB200 NVL72 / NVL36 compute trays
Next-generation AI factory racks
OEM / ODM liquid-cooled server platforms

Ordering & RFQ

How to order: quote part number TC-BZP-GB200-01A with quantity and required fitting type. Custom samples are available from a single piece, each with a leak-test report; production quantities follow drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 25 °C inlet with pure water. Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

NVIDIA and the GPU model names are trademarks of NVIDIA Corporation. Referenced for compatibility only; ToneCooling is an independent manufacturer.

Related guides

GB200 NVL72 cooling requirements — cold plates, manifold and CDU
GB200 cold plate RFQ inputs — pressure-drop budget and boundary conditions
GB200 liquid cooling guide — deployment notes
GPU cold plates — GB300, GB200, H200 and H100
GB300 cold plate — NVL72 kit specs
H200 liquid cooling plate — HGX H200 kit
H100 cooling plate — HGX H100 kit

Related products

NVIDIA H200 Liquid Cooling Plate: HGX H200 Direct-to-Chip Kit

ASIC / Switch Chip Liquid Cold Plate 1000–1500 W | T-HS202304/15/16

NVIDIA H100 8-GPU + NVSwitch Liquid Cooling Assembly | T-HS202323

NVIDIA H800 GPU Liquid Cold Plate | T-HS202308

Get A Free Quote Now

How Additive Manufacturing Achieves Lightweight Cold Plates

Additive manufacturing builds cold plates layer by layer, allowing lightweight, complex internal channels that machining cannot make, at higher cost […]

Learn More >>

Things to Know Before Bulk Buying Liquid Cold Plates

Before buying liquid cold plates in bulk, confirm the specification, approve samples, agree on test methods and records, and check […]

Learn More >>

Straight vs Inclined Channel Cold Plates for EV Thermal Management

Straight-channel cold plates have low pressure drop but can leave a temperature gradient along the flow, while inclined channels mix […]

Learn More >>

How Additive Manufacturing Improves Cold Plate Performance

Learn More >>

Transient Liquid Phase (TLP) Bonding in Heat Spreader Manufacturing

What Is Transient Liquid Phase Tlp Bonding? Definition and basic process — Transient liquid phase TLP bonding is a joining […]

Learn More >>