TC-LGA3647 Square CPU Cooler: High-Efficiency Thermal Engineered for Intel Xeon Scalable Square ILM Platforms

Optimized for Balanced Airflow, Multi-Socket Servers, and AI/HPC Workloads

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ToneCooling TC-LGA3647-R97 CPU Cooler thermal management
ToneCooling TC-LGA3647-4U-R92-CPU-Cooler Intel LGA3647 server cooling
ToneCooling TC-LGA3647-2U-S82-CPU-Cooler server rack thermal management
ToneCooling TC-LGA3647-2U-S81 CPU Cooler thermal management
Efficient Cooling Applications

Optimized heat dissipation design ensures stable operation under high loads.

Durability Applications

Made from high-quality materials, enhancing long-term reliability and durability.

Custom Solutions Applications

Provides tailored solutions based on client needs, meeting specific application requirements.

Energy Efficiency Applications

Effective cooling reduces energy consumption, adhering to environmental standards.

Why choose Coolserver for server cooling?

Advantages and Value of Coolserver for Industrial Automation Cooling:

  • High Efficiency: Coolserver’s designs offer effective heat dissipation, ensuring optimal performance of industrial machinery.
  • Reliability: Robust construction withstands harsh environments and heavy-duty operations, enhancing equipment longevity.
  • Customization: Tailored cooling solutions address specific automation needs, improving overall system efficiency.
  • Energy Savings: Enhanced cooling reduces energy consumption, lowering operational costs and promoting sustainability.

Product Positioning & Target Use Cases

ToneCooling Wide flow channel spoiler thermal management

Enterprise and hyperscale datacenter servers

ToneCooling K800-104 wide flow channel spoiler structure thermal management

AI inferencing and HPC workloads with sustained AVX-512 utilization

ToneCooling K800-104 wide flow channel structure thermal management

Rackmount platforms in 2U+ enclosures

ToneCooling 1 thermal management

Server-class workstations and high-density GPU nodes

More Information

1. What are our products used for?
Our products are mainly used in data center servers, graphics cards, power (ultra-high voltage, flexible DC, new energy), rail transportation (high-speed rail and urban rail transit), 5G communication, and IoT industries.
2. What can we do currently?
We can design and manufacture liquid cooling plates for high-power, high-heat- flux density chips. Our company has specialized equipment and processes such as friction stir welding, vacuum brazing, instantaneous liquid phase diffusion welding, laser welding, and flame welding, as well as specialized testing equipment for thermal resistance, flow resistance, and sealing. We also have 3D modeling and CAE and CFD simulation capabilities.
3. What are we currently researching and developing?
We are currently researching and developing high-power, high-heat-flux density liquid cooling plates, pump-drive two-phase cooling systems, high thermal conductivity composite materials, and spray jet direct cooling systems, among other high-power, high-heat-flux density cooling technologies.