LGA3647 4Z06 2U server CPU air cooler view 2

LGA3647 4Z06 2U server CPU air cooler view 3

LGA3647-4Z06 2U Server CPU Air Cooler | Intel LGA3647, 205 W

LGA3647-4Z06 is a 2U CPU air cooler for Intel LGA3647 processors, rated for a 205 W thermal load. Heat-pipe construction — copper base, aluminium fins, heat pipes — 108 × 78 × 64.5 mm overall, 3 heat pipes, PWM fan (PWM 2100-6800RPM).

205 W rated — 1st–2nd Gen Intel Xeon Scalable (Skylake / Cascade Lake-SP)
108 × 78 × 64.5 mm — 64.5 mm profile for 2U chassis
Copper base, aluminium fins, heat pipes — 3 heat pipes
PWM fan, 2100-6800RPM — double ball bearings, 12 V

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Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: rated 205 W in a 2U chassis with front-to-back airflow. Fin thickness —, fin spacing —; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper base, aluminium fins, heat pipes.
Fan: PWM 2100-6800RPM, 4pin PWM, Double Ball Bearings, 12 V — speed follows the board fan curve.
Mechanical: 108 × 78 × 64.5 mm; retention hardware for Intel LGA3647 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA3647-4Z06 Specifications

Parameter	Value
Model	LGA3647-4Z06
Product type	2U server CPU air cooler
Socket / platform	Intel LGA3647 — 1st–2nd Gen Intel Xeon Scalable (Skylake / Cascade Lake-SP)
Rated thermal load (TDP)	205 W
Overall size (L × W × H)	108 × 78 × 64.5 mm
Base / fin material	Copper base, aluminium fins, heat pipes
Heat pipes	3 PCS
Fan speed	PWM 2100-6800RPM
Fan connector	4pin PWM
Rated voltage	12 V
Bearing	Double Ball Bearings
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

2U rack servers and hyper-converged nodes
GPU and storage servers
Server OEM and ODM programmes

Ordering & RFQ

How to order: quote model LGA3647-4Z06 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.