AAM5 1B06 2U server CPU air cooler view 2

AAM5 1B06 2U server CPU air cooler view 3

AAM5-1B06 2U Server CPU Heatsink | AMD AM5, 210 W

AAM5-1B06 is a 2U passive CPU heatsink for AMD AM5 processors, rated for a 210 W thermal load. Heat-pipe construction — vapor chamber base, aluminium fins — 70 × 104 × 64 mm overall, 3 heat pipes.

210 W rated — AMD Ryzen 7000 / 9000, EPYC 4004 (AM5)
70 × 104 × 64 mm — 64 mm profile for 2U chassis
Vapor chamber base, aluminium fins — 3 heat pipes
Passive heatsink — for chassis-ducted airflow; no fan power required

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Engineering overview

Thermal: rated 210 W in a 2U chassis with front-to-back airflow. Fin thickness 0.4 mm, fin spacing 2.1 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Vapor chamber base, aluminium fins.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 70 × 104 × 64 mm; retention hardware for AMD AM5 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

AAM5-1B06 Specifications

Parameter	Value
Model	AAM5-1B06
Product type	2U server passive CPU heatsink
Socket / platform	AMD AM5 — AMD Ryzen 7000 / 9000, EPYC 4004 (AM5)
Rated thermal load (TDP)	210 W
Overall size (L × W × H)	70 × 104 × 64 mm
Base / fin material	Vapor chamber base, aluminium fins
Heat pipes	3 PCS
Fin thickness	0.4 mm
Fin spacing	2.1 mm
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

2U rack servers and hyper-converged nodes
GPU and storage servers
Server OEM and ODM programmes

Ordering & RFQ

How to order: quote model AAM5-1B06 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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