T-HS202314-MOS liquid cooling plate
》Efficient heat dissipation and noise control.
》Higher performance and extended graphics card life.
》Compatible with, and manufactured from highly thermally conductive
materials such as copper and aluminum.
》Easy to install.
》Seamless and perfect joint, no worries about leakage.
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CPU GPU Liquid cold plates Features
The key features of MOS (Metal-Oxide-Semiconductor) liquid cooling plates include:
1. High Thermal Efficiency
- Designed to effectively dissipate heat from MOSFETs, IGBTs, and other power semiconductor devices.
- Features optimized internal channels, such as microchannels, to maximize heat transfer.
2. Compact and Customizable Design
- Compact form factor to fit within tight electronic assemblies.
- Customizable dimensions and layouts to match specific device requirements.
3. Durable Materials
- Constructed with corrosion-resistant materials like aluminum or copper to support various coolant types.
- Enhanced structural integrity to withstand high-pressure cooling systems.
4. Leak-Proof Sealing
- High-quality sealing mechanisms to ensure reliable operation without coolant leakage.
- Suitable for long-term operation in harsh environments.
5. Easy Integration
- Standardized or customizable fluid connectors for easy integration into liquid cooling systems.
- Supports diverse cooling fluids, such as water, glycol-based mixtures, or dielectric coolants.
6. Efficient Heat Distribution
- Even heat dissipation across the cooling plate to prevent thermal hotspots.
- Ensures stable performance of high-power devices under continuous load.
MOS liquid cooling plate Technical/Data Sheet
| Model | Category |
| T-HS202314 | High power MOS |
| Welding process | heat source Total power |
| Aluminum alloy Vacuum brazing | 2500W |
| Working environment | cold plate surface temperature |
| 55°C，6.5LPM，56%EGW | below65°C |
| flow resistance | Resistant to stress |
| Below12KPa | 1Mpa |
1.Computer Applications 2.Data Center Applications 3.Server Applications 4.Gaming PC Applications
The MOS (Metal-Oxide-Semiconductor) liquid cooling plate is primarily used in high-power electronic devices and applications requiring efficient thermal management. Key application areas include:
1. Power Electronics
- Inverters: Such as photovoltaic inverters, wind turbine inverters, and power conversion equipment in electric vehicle drive systems.
- IGBT Modules: Critical electronic components for high-voltage, high-power scenarios requiring efficient cooling to ensure stability.
2. Electric Vehicles and Power Systems
- Electric Vehicles (EVs): Thermal management for MOSFETs and IGBT modules in EV control units.
- Charging Stations: Heat dissipation for power modules in fast-charging stations.
3. Industrial Automation and Control
- Drive modules in industrial robots and motion control systems.
- Thermal management for motor drives and servo control systems.
4. Renewable Energy
- Power conversion modules in solar power and wind energy systems.
5. High-Performance Computing and Data Centers
- Power management units (PMUs) and power modules in servers and data centers.
6. Aerospace and Defense
- Thermal management in high-power radar systems.
- Cooling for power modules in aircraft power control units and weapon systems.
