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Custom-Engineered Solar Type 3D Vapor Chamber for Unique Thermal Challenges
Custom-Engineered Solar Type 3D Vapor Chamber for Unique Thermal Challenges
3D Vapor Chamber (3DVC) lying on a flat surface from a top view - 2 tubes
Custom-Engineered Solar Type 3D Vapor Chamber for Unique Thermal Challenges
Custom-Engineered Solar Type 3D Vapor Chamber for Unique Thermal Challenges
3D Vapor Chamber (3DVC) lying on a flat surface from a top view - 2 tubes

3D Vapor Chamber (3DVC) – 2 Tubes

3D Vapor Chamber (3DVC) is a three-dimensional structure that combines the advantages of a vapor chamber and a heat pipe, capable of transferring heat to any corner. The internal cavities of the heat pipe and the heat plate are interconnected, along with the capillary wick, expanding the steam space and facilitating the rapid return of liquid to the evaporation end. This design enables heat conduction in three dimensions. In comparison to heat pipes and flat vapor chambers, 3D Vapor Chamber (3DVC) offers higher power and lower thermal resistance.

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Vapor Chamber Description

  1. High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
  2. Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
  3. Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
  4. Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
  5. High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
  6. Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.

Vapor Chamber Technical/Data Sheet

Substrate size50-45-4
Heat pipe sizeD10*L120*N2
Power120W
Heat flux density37(W/cm2)
Heat source size:18*18mm
Application industryOptical Module

3D temperature plates (3DVC) can be customized

Maximum size400 x 300 mm
Tube length30-300 mm
Tube structurbendable and flattened
Maximum power1500W

3DVC Heat Sink

POWER(W)Tc (°C)Ta (°C)AT (°C)R (C/W)
11539.525.214.30.124
16545.325.120.20.122
21551.125.425.70.12
2655725.631 .40.118
31562.525.437.10.118
3656825.642.40.116

HP Heat Sink

POWER(W)Tc (°C)Ta (°C)AT (°C)R (C/W)
1154625210.183
16554.324.929.40.178
21562.825.137.70.175
26569.425.144.30.167
31081.125.1560.181
Copper Tube DiameterMin. A(mm)Min. B(mm)Min. C(mm)Min. D (mm)Min. E(mm)Min. F(mm)Min.G(mm)
6131334163.263
8141436183.283
10151538203.283
12161640223.2103

Vapor Chamber Applications

  • Electronics and Computing Applications: Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
  • Telecommunications Applications: Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
  • Automotive Industry Applications: Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
  • Aerospace Applications: Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
3D Vapor Chamber (3DVC) - 2 Tubes Detail Display

3D Vapor Chamber (3DVC) – 2 Tubes: Revolutionize thermal management with ultra-efficient heat dissipation for high-performance electronics, data centers, and compact devices. Dual-chamber design eliminates hotspots, reduces component stress, and ensures stable operation under heavy loads. Lightweight, space-saving, and easy to integrate—upgrade your cooling solution for longer lifespan and silent performance. Optimize thermal efficiency now!

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Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

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