3D Vapor Chamber(3DVC)-126.8*97.8*5.8*H60mm
3D Vapor Chamber(3DVC)-126.8×97.8×5.8H×60mm
·High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
·Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
·Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
·Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
·High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
·Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.
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Vapor Chamber Technical/Data Sheet
| Substrate size | Heat pipe size | Power |
| 126.8 x 97.8 x 5.8 | D6*L160*N14 | 600W |
| Heat flux density | Heat source size | Application Industry |
| 37.5 W/cm² | 40*40 mm | Server |
3D Vapor Chamber (3DVC) is a three-dimensional structure that combines the advantages of a vapor chamber and a heat pipe, capable of transferring heat to any corner. The internal cavities of the heat pipe and the heat plate are interconnected, along with the capillary wick, expanding the steam space and facilitating the rapid return of liquid to the evaporation end. This design enables heat conduction in three dimensions. In comparison to heat pipes and flat vapor chambers, 3D Vapor Chamber (3DVC) offers higher power and lower thermal resistance.
3D temperature plates (3DVC) can be customized.
| Maximum size | Tube length |
| 400 x 300 mm | 30-300 mm |
| Tube structure | Maximum power |
| bendable and flattened | 1500W |
3DVC Heat Sink
| POWER(W) | Tc (°C) | Ta (°C) | AT (°C) | R (°C/W) |
| 115 | 39.5 | 25.2 | 14.3 | 0.124 |
| 165 | 45.3 | 25.1 | 20.2 | 0.122 |
| 215 | 51.1 | 25.4 | 25.7 | 0.12 |
| 265 | 57 | 25.6 | 31 .4 | 0.118 |
| 315 | 62.5 | 25.4 | 37.1 | 0.118 |
| 365 | 68 | 25.6 | 42.4 | 0.116 |
HP Heat Sink
| POWER(W) | Tc (°C) | Ta (°C) | AT (°C) | R (C/W) |
| 115 | 46 | 25 | 21 | 0.183 |
| 165 | 54.3 | 24.9 | 29.4 | 0.178 |
| 215 | 62.8 | 25.1 | 37.7 | 0.175 |
| 265 | 69.4 | 25.1 | 44.3 | 0.167 |
| 310 | 81.1 | 25.1 | 56 | 0.181 |
Thickness of the heat plate F. Length of the ineffective end of the heat pipe G. Height of the flange at the connection between the heat plate and the heat pipe
| Copper tube diameter | Min. A | Min. B | Min. C | Min. D | Min. E | Min. F | Min. G |
| （mm） | （mm） | （mm） | （mm） | （mm） | （mm） | （mm） | （mm） |
| 6 | 13 | 13 | 34 | 16 | 3.2 | 6 | 3 |
| 8 | 14 | 14 | 36 | 18 | 3.2 | 8 | 3 |
| 10 | 15 | 15 | 38 | 20 | 3.2 | 8 | 3 |
| 12 | 16 | 16 | 40 | 22 | 3.2 | 10 | 3 |
1.Electronics and Computing Applications 2.Telecommunications Applications 3.Automotive Industry Applications 4.Aerospace Applications
1.Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
2.Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
3.Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
4.Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
3D Vapor Chamber(3DVC) Detail Display
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