LGA1156 6B01 1U server CPU air cooler view 2

LGA1156 6B01 1U server CPU air cooler view 3

LGA1156-6B01 1U Server CPU Heatsink | Intel LGA115x / 1200, 95 W

LGA1156-6B01 is a 1U passive CPU heatsink for Intel LGA115x / 1200 processors, rated for a 95 W thermal load. Solid-metal construction — copper — 88 × 88 × 23 mm overall. Mounting hole pitch 75 x 75 mm.

95 W rated — Intel Xeon E3 / Core (LGA115x, LGA1200)
88 × 88 × 23 mm — 23 mm profile for 1U chassis
Copper
Passive heatsink — for chassis-ducted airflow; no fan power required

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: rated 95 W in a 1U chassis with front-to-back airflow. Fin thickness 0.35 mm, fin spacing 1.9 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 88 × 88 × 23 mm; mounting hole pitch 75 x 75 mm; retention hardware for Intel LGA115x / 1200 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA1156-6B01 Specifications

Parameter	Value
Model	LGA1156-6B01
Product type	1U server passive CPU heatsink
Socket / platform	LGA1156 (square ILM) — Intel Xeon E3 / Core (LGA115x, LGA1200)
Rated thermal load (TDP)	95 W
Overall size (L × W × H)	88 × 88 × 23 mm
Mounting hole pitch	75 x 75 mm
Base / fin material	Copper
Fin thickness	0.35 mm
Fin spacing	1.9 mm
Rated voltage	12 V
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA1156-6B01 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.