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ToneCooling TC-LGA115X-1U1C CPU Cooler thermal management
ToneCooling LGA115X-1U1C CPU Cooler thermal management
ToneCooling TC-LGA115X-1U1C CPU Cooler thermal management
ToneCooling LGA115X-1U1C CPU Cooler thermal management

TC-LGA115X-1U1C CPU Cooler: Compact Thermal Solution for 1U LGA115X Server Systems

The TC-LGA115X-1U1C CPU Cooler is a low-profile, high-efficiency cooling solution designed for Intel® LGA115X socket processors, including LGA1150, LGA1151, LGA1155, and LGA1156. Engineered for 1U rackmount server environments, this cooler delivers reliable thermal performance in space-constrained enclosures. With a solid copper core and a high-speed fan, it ensures optimal heat dissipation and system stability for entry-level server workloads and embedded applications.

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Key Features

  • Intel® LGA115X Socket Compatibility
    Supports Intel® Core™, Xeon® E3, Pentium®, and Celeron® processors on LGA1150, 1151, 1155, and 1156 platforms, providing broad compatibility across commercial and embedded systems.

  • 1U Low-Profile Design
    Specifically designed for 1U rackmount chassis, making it ideal for dense server environments where vertical space is limited.

  • Copper Core for Superior Heat Conductivity
    Equipped with a solid copper core that provides fast heat transfer from the CPU to the heatsink, ensuring stable operation under continuous loads.

  • High-Speed PWM-Controlled Fan
    Features a high-performance fan with PWM support, allowing for intelligent speed adjustments to balance cooling efficiency and noise levels.

  • Tool-Free Installation
    Easy-to-mount design reduces installation time and ensures consistent contact pressure for optimal thermal performance.

TC-LGA115X-1U1C Technical

  • TC-LGA115X-1U1C radiator (for 1U servers)
  • Product model: TC-LGA115X-1U1C
  • CPU type: TC-LGA115X (square motherboard)
  • Voltage: 12V
  • Product size: 88mm*88mm*23mm
  • CPU hole distance: 75mm*75mm
  • Fin thickness: 0.35mm
  • Fin spacing: 1.9mm
  • Power consumption: 95W
  • Material: copper base + copper fins

Application Fields

1. 1U Rackmount Servers

Ideal for compact data center or enterprise servers built on LGA115X platforms, handling lightweight workloads such as file serving, basic virtualization, or internal applications.

2. Edge Computing and Micro Data Centers

Used in edge devices or micro data centers where space is limited and reliable thermal performance is critical for continuous operation.

3. Network Appliances and Firewalls

Perfect for 1U network appliances including routers, firewalls, and load balancers that operate 24/7 and require compact, quiet cooling.

4. Embedded and Industrial Systems

Fits into industrial PCs, automation controllers, and embedded platforms installed in space-constrained environments such as manufacturing floors, transportation hubs, or kiosks.

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

Need a Custom Liquid Cold Plate?

Tell us your thermal requirements. Engineering team responds within 48 hours with design proposal and quotation.

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MOQ 5 pcs • Prototype 7-15 days • ISO 9001 Certified

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