LGA1156 6Z03 1U server CPU air cooler view 2

LGA1156 6Z03 1U server CPU air cooler view 3

LGA1156-6Z03 1U Server CPU Air Cooler | Intel LGA115x / 1200, 110 W

LGA1156-6Z03 is a 1U CPU air cooler for Intel LGA115x / 1200 processors, rated for a 110 W thermal load. Solid-metal construction — copper — 83 × 83 × 28 mm overall, PWM fan (PWM 2000-5000RPM). Mounting hole pitch 75 x 75 mm.

110 W rated — Intel Xeon E3 / Core (LGA115x, LGA1200)
83 × 83 × 28 mm — 28 mm profile for 1U chassis
Copper
PWM fan, 2000-5000RPM — double ball bearings, 12 V

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Engineering overview

Thermal: rated 110 W in a 1U chassis with front-to-back airflow. Fin thickness —, fin spacing —; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Fan: PWM 2000-5000RPM, 4-pin PWM, Double Ball Bearings, 12 V — speed follows the board fan curve.
Mechanical: 83 × 83 × 28 mm; mounting hole pitch 75 x 75 mm; retention hardware for Intel LGA115x / 1200 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA1156-6Z03 Specifications

Parameter	Value
Model	LGA1156-6Z03
Product type	1U server CPU air cooler
Socket / platform	LGA1156 (square ILM) — Intel Xeon E3 / Core (LGA115x, LGA1200)
Rated thermal load (TDP)	110 W
Overall size (L × W × H)	83 × 83 × 28 mm
Mounting hole pitch	75 x 75 mm
Base / fin material	Copper
Fan speed	PWM 2000-5000RPM
Rated voltage	12 V
Bearing	Double Ball Bearings
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA1156-6Z03 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

Related products

LGA1156-6Z06 2U Server CPU Air Cooler | Intel LGA115x / 1200, 110 W

LGA1156-6B10 1U Server CPU Heatsink | Intel LGA115x / 1200, 95 W

LGA1156-6Z05 1U Server CPU Air Cooler | Intel LGA115x / 1200, 95 W

LGA1156-6Z04 1U Server CPU Air Cooler | Intel LGA115x / 1200, 85 W

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How the LGA1156-6Z03 compares with related models

Compared with the LGA1156-6Z05, the LGA1156-6Z03 differs in rated thermal load TDP (110 W vs 95 W), overall size L × W × H (83 × 83 × 28 mm vs 72 × 70 × 28 mm). Compared with the LGA1156-6Z06, the LGA1156-6Z03 differs in product type (1U server CPU air cooler vs 2U server CPU air cooler), overall size L × W × H (83 × 83 × 28 mm vs 90 × 89 × 47 mm), fan speed (PWM 2000-5000RPM vs PWM 1700-4300RPM).

By rated thermal load TDP, the LGA1156-6Z03 is rated at 110 W; the next lower rating in this range is the LGA1156-6Z05 (95 W). Select on the confirmed duty point rather than on the headline rating alone.

Source: the specification tables on this page and on the linked ToneCooling model pages. Values are catalogue references; the operating point is confirmed in the quotation.

By ToneCooling Engineering Team · Last updated: October 11, 2026