LGA2011 5Z08 2U server CPU air cooler view 2

LGA2011-5Z08 2U Server CPU Air Cooler | Intel LGA2011, 110 W

LGA2011-5Z08 is a 2U CPU air cooler for Intel LGA2011 processors, rated for a 110 W thermal load. Solid-metal construction — copper — 104 × 65 × 47 mm overall, PWM fan (PWM 1700-4300RPM). Mounting hole pitch 56 x 94 mm.

110 W rated — Intel Xeon E5 v3 / v4 (LGA2011-3)
104 × 65 × 47 mm — 47 mm profile for 2U chassis
Copper
PWM fan, 1700-4300RPM — double ball bearings, 12 V

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Engineering overview

Thermal: rated 110 W in a 2U chassis with front-to-back airflow. Fin thickness —, fin spacing —; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Fan: PWM 1700-4300RPM, 4-pin PWM, Double Ball Bearings, 12 V — speed follows the board fan curve.
Mechanical: 104 × 65 × 47 mm; mounting hole pitch 56 x 94 mm; retention hardware for Intel LGA2011 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA2011-5Z08 Specifications

Parameter	Value
Model	LGA2011-5Z08
Product type	2U server CPU air cooler
Socket / platform	LGA2011 (narrow ILM) — Intel Xeon E5 v3 / v4 (LGA2011-3)
Rated thermal load (TDP)	110 W
Overall size (L × W × H)	104 × 65 × 47 mm
Mounting hole pitch	56 x 94 mm
Base / fin material	Copper
Fan speed	PWM 1700-4300RPM
Rated voltage	12 V
Bearing	Double Ball Bearings
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

2U rack servers and hyper-converged nodes
GPU and storage servers
Server OEM and ODM programmes

Ordering & RFQ

How to order: quote model LGA2011-5Z08 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

Related products

LGA2011-5Z04 1U Server CPU Air Cooler | Intel LGA2011, 95 W

LGA2011-5B02 1U Server CPU Heatsink | Intel LGA2011, 95 W

TC-LGA2011-1U1C-1 CPU Cooler: Efficient Cooling Solution for LGA 2011 Processors in 1U Servers

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How the LGA2011-5Z08 compares with related models

Compared with the LGA2011-5Z04, the LGA2011-5Z08 differs in product type (2U server CPU air cooler vs 1U server CPU air cooler), rated thermal load TDP (110 W vs 95 W), overall size L × W × H (104 × 65 × 47 mm vs 104 × 74 × 28 mm), mounting hole pitch (56 x 94 mm vs 94 x 56 mm), fan speed (PWM 1700-4300RPM vs PWM 2000-5000RPM).

By rated thermal load TDP, the LGA2011-5Z08 is rated at 110 W; the next lower rating in this range is the LGA2011-5Z04 (95 W). Select on the confirmed duty point rather than on the headline rating alone.

Source: the specification tables on this page and on the linked ToneCooling model pages. Values are catalogue references; the operating point is confirmed in the quotation.

By ToneCooling Engineering Team · Last updated: October 11, 2026