LGA2011 5B02 1U server CPU air cooler view 2

LGA2011 5B02 1U server CPU air cooler view 3

LGA2011-5B02 1U Server CPU Heatsink | Intel LGA2011, 95 W

LGA2011-5B02 is a 1U passive CPU heatsink for Intel LGA2011 processors, rated for a 95 W thermal load. Solid-metal construction — copper — 88 × 88 × 23 mm overall. Mounting hole pitch 80 x 80 mm.

95 W rated — Intel Xeon E5 v3 / v4 (LGA2011-3)
88 × 88 × 23 mm — 23 mm profile for 1U chassis
Copper
Passive heatsink — for chassis-ducted airflow; no fan power required

Products Categories

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Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: rated 95 W in a 1U chassis with front-to-back airflow. Fin thickness 0.35 mm, fin spacing 1.9 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 88 × 88 × 23 mm; mounting hole pitch 80 x 80 mm; retention hardware for Intel LGA2011 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA2011-5B02 Specifications

Parameter	Value
Model	LGA2011-5B02
Product type	1U server passive CPU heatsink
Socket / platform	LGA2011 (square ILM) — Intel Xeon E5 v3 / v4 (LGA2011-3)
Rated thermal load (TDP)	95 W
Overall size (L × W × H)	88 × 88 × 23 mm
Mounting hole pitch	80 x 80 mm
Base / fin material	Copper
Fin thickness	0.35 mm
Fin spacing	1.9 mm
Rated voltage	12V
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA2011-5B02 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.