Last Updated: 2026-04-10 | Author: ToneCooling Thermal Engineering Team
Core EVAC Technology Architecture
1. EVAC (Enhanced Vapor-Air Convection) Module
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Multi-phase Heat Transfer Integration: Combines vapor chamber and high-pressure micro-channel airflow paths for rapid heat conduction and dissipation across vapor and air phases.
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Coldflow Inductors: Specially angled deflectors guide cool air to hotspots, increasing airflow efficiency by 40%.
2. Multi-Angle Thermal Pipe Array
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Embedded 6-Heatpipe Structure: Six Φ6mm heatpipes arranged in a “Z” shape are embedded into the base, shortening thermal paths and improving heat distribution uniformity.
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3D Thermal Loop Segmentation: Each heatpipe serves distinct CPU zones, eliminating thermal concentration. Overall thermal resistance drops below 0.015°C/W.
3. Twin-Axial Airflow System
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Dual-Zone Fan Design: Two independent fans provide dedicated airflow for central and edge heat zones, forming dual-pressure airflow architecture.
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Maglev Fans with PWM Control: Speeds range from 900 to 11,000 RPM. Noise stays under 36dB under full load.
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