ToneCooling 2U-FA35 (EVAC) CPU Cooler thermal management

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TC-LGA9324-2U-FA35 (EVAC) CPU Cooler: Unleashing Next-Gen 2U Cooling for AI and Hyperscale Compute

The TC-LGA9324-2U-FA35 (FA35) is a next-generation 2U CPU cooler engineered for Intel’s LGA9324 socket (e.g., Xeon Ultra 9000 and upcoming Xeon Ultra Gaudi platforms).

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Core EVAC Cooling Architecture

1. Dual-Chamber EVAC Vapor System

Isolated Vapor Zones: Features a dual-zone vapor chamber (hotspot + base), balancing CPU core and I/O die thermal loads.
Advanced Phase-Change Optimization: Carbon nanotube-enhanced inner wall coatings boost boiling performance, reaching thermal flux densities up to 600W/cm².

2. 10-Heatpipe Array with Dual-Phase Loop

10 × Φ6mm Heatpipes, integrated in a hybrid planar-stacked layout
Optimized heatpipe tilt and internal wicking for performance across all orientations
Thermal resistance reduced to < 0.012°C/W, suitable for CPUs up to 1200W TDP

3. Multi-Fan Counter-Rotation System

Three 9238 Maglev Fans, two counter-rotating pairs and one booster fan
Independent Zoning: Variable fan speeds in each zone, controlled by real-time workload profiling
Air pressure improved by 45% compared to traditional 2U coolers, noise maintained under 39dB

TC-LGA9324-2U-FA35 (EVAC) CPU Cooler Technical

Product model: TC-LGA9324-2U-FA35 (EVAC)

CPU type: TC-LGA9324

Product size: 354.2mm*228.3mm*81mm

Power consumption: 700W

Application Scenarios

The TC-LGA9324-2U-FA35 (FA35) is a next-generation 2U CPU cooler engineered for Intel’s TC-LGA9324 socket (e.g., Xeon Ultra 9000 and upcoming Xeon Ultra Gaudi platforms). It is purpose-built for:

Hyperscale AI training and inference clusters
GPU-accelerated cloud servers with hybrid CPU-GPU airflow zones
Edge AI base stations and high-TDP computing at remote locations
Emerging telecom/5G MEC and car-grade compute environments

Design Focus:
With EVAC (Enhanced Vapor-Air Convection) architecture, the FA35 tackles ultra-high TDP (1000–1200W) CPUs, providing efficient, quiet, and highly stable cooling in a 2U form factor. It ensures thermal headroom for full-speed operation under 24/7 AI workloads.

Advanced Reliability & Maintenance

MTBF: >300,000 hours (per MIL-HDBK-217F)
Shock Resistance: Certified for edge, telecom, and mobile applications (EN 50155, IEC 60068-2-6)
Environmental Tolerance: Operates in -40°C to 75°C ambient ranges

Maintenance Features

Fan Module Hot-Swap Support: Tool-free latch, swappable under power
Predictive Health Monitoring: Tracks fan wear, blockage, and dust via I2C/SMBus output
Nanocoated Self-Cleaning Blades: Dust resistance extended to 2.5-year intervals