Guangdong, China
Global Engineering RFQ Review
Server CPU Liquid Cooling | RFQ Support

CPU Cold Plate Pressure Drop and Flow Rate Review

Flow rate and pressure drop define whether a CPU cold plate can remove the target heat while staying inside the pump and rack coolant budget. ToneCooling reviews the customer heat load, coolant, channel route, fitting layout and system pressure-drop limit before recommending a manufacturable cold plate path.

Send Flow Rate and Pressure-Drop TargetView Server CPU Cold Plate Hub
CPU Cold Plate Pressure Drop and Flow Rate Review

Engineering Inputs to Confirm

Flow-rate targetProvide target LPM per cold plate or per branch.
Pressure-drop limitProvide maximum acceptable pressure drop at the specified flow rate.
Coolant conditionCoolant type, concentration and inlet temperature affect viscosity and design margin.
System boundaryManifold, quick-disconnect, tube length and fitting choices should be included where known.

Related Product Paths

ToneCooling TC-1000 server CPU direct-to-chip liquid cooling

TC-1000

Current listing data for engineering confirmation: 1000 W -Pure Water -Copper

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ToneCooling TC-1500 server CPU direct-to-chip liquid cooling

TC-1500

Current listing data for engineering confirmation: 1500 W -Pure Water -Copper

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AMD EPYC SP5 liquid cold plate for server CPU cooling

AMD EPYC SP5 Direct-to-Chip Cold Plate

Current listing data for engineering confirmation: [CONFIRM: up to] 800 W -AMD EPYC SP5

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RFQ Checklist

Upload a drawing, CAD file or thermal specification if available. If drawings are not ready, send the closest platform reference and the following inputs:

  • Drawing or CAD file
  • CPU/platform or module footprint
  • Heat load and inlet temperature
  • Coolant type and concentration
  • Flow rate and pressure-drop target
  • Port direction and hose routing
  • Prototype quantity and annual demand
  • Leak / pressure / cleanliness requirement

Common Review Risk

A page that only states heat load without hydraulic limits attracts weak RFQs; engineers need both thermal and flow constraints.

Related Engineering Resources

External Engineering References

FAQ

What should be sent before quotation?

Send the drawing or closest mechanical reference, heat load, coolant, flow rate, pressure-drop target, port layout, quantity and validation requirement.

Can ToneCooling confirm compatibility from the socket name alone?

No. Socket or platform names are useful references, but final layout and performance review require the customer drawing, server envelope and validation plan.

Where are these server CPU cold plates manufactured?

Manufacturing is based in Huizhou, Guangdong, China. Public copy should not state local manufacturing for regional markets unless separately verified.

Is a complete simulation required before RFQ?

A simulation is helpful but not mandatory for first review. If simulation data is not ready, share heat load, coolant, flow rate, pressure-drop target and available envelope information.

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