Can ToneCooling design a custom liquid cold plate?

Yes. ToneCooling designs custom liquid cold plates around the customer heat load, coolant, flow rate, pressure drop limit, mechanical envelope, and production requirement.

What information is needed for a quote?

Please provide heat load, coolant type, flow rate, maximum pressure drop, inlet temperature, target case temperature, mechanical envelope, mounting requirements, material preference, quantity, and drawings if available.

Copper or aluminum, which is better?

Copper improves heat spreading for high heat flux zones. Aluminum can reduce weight and cost when the thermal target, coolant chemistry, corrosion control, and pressure requirement allow it.

How do you control pressure drop?

Pressure drop is controlled through channel width, path length, manifold balance, parallel flow layout, port size, and the specified flow rate.

Can you support microchannel cold plates?

Yes. Microchannel designs can be reviewed when the heat flux, pressure drop budget, manufacturability, cleaning process, and reliability requirements are suitable.

Do you provide DFM review before production?

Yes. ToneCooling reviews sealing, port design, flatness, tolerances, leakage risk, coolant compatibility, and process selection before prototype or batch production.

What leak testing is performed?

Leak testing is specified around the working pressure, coolant, joining process, and customer standard. Final pressure and acceptance criteria are confirmed during DFM.

Can you support prototype and OEM production?

Yes. ToneCooling supports prototype builds, engineering iteration, pilot runs, and OEM batch production for custom thermal management parts.

Server CPU Liquid Cooling | RFQ Support

Server Liquid Cooling Module Envelope Review for 1U, 2U and Custom Chassis

A server liquid cooling module RFQ should define the chassis envelope, processor or module platform, radiator space, pump requirement, hose routing, coolant, flow rate, pressure-drop limit and validation scope. For 1U, 2U and custom chassis, packaging constraints can be as important as the cold plate itself.

Send Server Module Envelope Requirements View Server CPU Cold Plate Hub

Server Liquid Cooling Module Envelope Review for 1U, 2U and Custom Chassis

Engineering Inputs to Confirm

Chassis envelope	1U, 2U, 4U or custom height, available radiator and tube routing space.
Cooling module	Cold plate, pump, radiator, fan, tube and fitting requirements.
Electrical/input limits	Pump voltage, fan airflow, noise target and control requirement if applicable.
Validation	Leak, pressure, vibration/serviceability and documentation needs.

RFQ Checklist

Upload a drawing, CAD file or thermal specification if available. If drawings are not ready, send the closest platform reference and the following inputs:

Drawing or CAD file
CPU/platform or module footprint
Heat load and inlet temperature
Coolant type and concentration
Flow rate and pressure-drop target
Port direction and hose routing
Prototype quantity and annual demand
Leak / pressure / cleanliness requirement

Common Review Risk

Module RFQs with only CPU type but no radiator or pump envelope usually require follow-up before quotation.

Related Engineering Resources

External Engineering References

FAQ

What should be sent before quotation?

Send the drawing or closest mechanical reference, heat load, coolant, flow rate, pressure-drop target, port layout, quantity and validation requirement.

Can ToneCooling confirm compatibility from the socket name alone?

No. Socket or platform names are useful references, but final layout and performance review require the customer drawing, server envelope and validation plan.

Where are these server CPU cold plates manufactured?

Manufacturing is based in Huizhou, Guangdong, China. Public copy should not state local manufacturing for regional markets unless separately verified.

Is a complete simulation required before RFQ?

A simulation is helpful but not mandatory for first review. If simulation data is not ready, share heat load, coolant, flow rate, pressure-drop target and available envelope information.