AMD EPYC SP3 Cold Plate RFQ Inputs for Server Liquid Cooling
An AMD EPYC SP3 cold plate RFQ needs socket layout, mounting envelope, thermal target, coolant, flow rate, pressure-drop limit and port direction. SP3 projects may use different chassis and service constraints, so ToneCooling reviews the drawing before quoting exact configuration.
Request SP3 Cold Plate ReviewView Server CPU Cold Plate Hub
Engineering Inputs to Confirm
| Socket and mounting | SP3 platform drawing, hole pattern and keep-out areas. |
|---|---|
| Cold plate envelope | Available height, memory clearance and fitting direction. |
| Coolant and flow | Coolant type, inlet temperature, flow rate and pressure-drop target. |
| Quantity and stage | Prototype quantity, annual demand and project stage. |
Related Product Paths
AMD EPYC SP3 CPU Liquid Cold Plate
Current listing data for engineering confirmation: 260 W -25% EGW -Copper
View product page
TC-1000
Current listing data for engineering confirmation: 1000 W -Pure Water -Copper
View product pageRFQ Checklist
Upload a drawing, CAD file or thermal specification if available. If drawings are not ready, send the closest platform reference and the following inputs:
- Drawing or CAD file
- CPU/platform or module footprint
- Heat load and inlet temperature
- Coolant type and concentration
- Flow rate and pressure-drop target
- Port direction and hose routing
- Prototype quantity and annual demand
- Leak / pressure / cleanliness requirement
Common Review Risk
Related Product Page
Related Engineering Resources
Parent page for platform cold plates, high-power CPU cold plates and server cooling modules.
General custom cold plate RFQ checklist for drawings, heat load, coolant, flow and pressure-drop inputs.
Related data center GPU and AI server cold plate review page.
Start a drawing-based RFQ with technical inputs and project notes.
External Engineering References
FAQ
What should be sent before quotation?
Send the drawing or closest mechanical reference, heat load, coolant, flow rate, pressure-drop target, port layout, quantity and validation requirement.
Can ToneCooling confirm compatibility from the socket name alone?
No. Socket or platform names are useful references, but final layout and performance review require the customer drawing, server envelope and validation plan.
Where are these server CPU cold plates manufactured?
Manufacturing is based in Huizhou, Guangdong, China. Public copy should not state local manufacturing for regional markets unless separately verified.
Is a complete simulation required before RFQ?
A simulation is helpful but not mandatory for first review. If simulation data is not ready, share heat load, coolant, flow rate, pressure-drop target and available envelope information.
