NVIDIA H200 server board cooling
NVIDIA H200 Liquid Cold Plate GPU + Switch Cooling Board
Direct-to-chip liquid cooling board set for NVIDIA H200 servers: eight 700 W GPU positions plus four switch positions (4 × 186 W), tunnel-furnace brazed under nitrogen protection, CFD validated before tooling and leak tested in production.
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Download datasheet (PDF)
Key specifications
| Model | NVIDIA H200 liquid cooling board (GPU + switch plates) |
|---|---|
| Heat dissipation | 700 W × 8 GPU + 186 W × 4 switch positions |
| Material | Copper, CNC machined |
| Joining method | Continuous nitrogen-protection tunnel-furnace brazing |
| Test conditions | Pure water coolant, 38°C inlet temperature |
| Flow rate / pressure drop | 8.0 LPM at 18.5 kPa (±20%) |
| Cold plate surface temperature | <65°C under rated load |
| Working pressure | 0.8 MPa |
| Dimensions | GPU plate 151 × 78.2 × 43.14 mm; switch plate 80 × 64.3 × 7.6 mm |
| Thermal resistance (plate, rated point) | ≤0.039 °C/W per GPU position — calculated as (surface-temperature limit − coolant inlet) / heat load: (65 − 38)°C / 700 W |
| ΔP–flow curve | Measured ΔP–flow curve is supplied with the prototype test report and DFM review — request it with your drawing |
| Wetted materials | Copper (C1100 / T2) channel and port surfaces; fittings, tubing and quick disconnects per customer specification — confirmed against your coolant during DFM |
| CAD / drawings | STEP model and 2D drawing available under NDA — request with your RFQ |
| Validation | CFD flow and thermal simulation; helium leak and proof-pressure testing |
NVIDIA H200 Liquid Cold Plate datasheet (PDF)
Full specification table, dimensions, coolant and test conditions, materials and joining method — ready to drop into your thermal review.
ToneCooling manufactures the NVIDIA H200 Liquid Cold Plate — 700 W × 8 GPU + 186 W × 4 switch positions, CFD-validated before tooling and 100% leak tested under ISO 9001 at our Guangdong technical center, with North American customers supported by ToneCooling Texas LLC.
Why ToneCooling
Design, engineering, and manufacturing run in-house at the ToneCooling technical center in Guangdong — one accountable partner from CFD model to leak-tested hardware. Continuous nitrogen-protection tunnel-furnace brazing gives the assembly durable joints under repeated thermal cycling, and every part ships with the test documentation your qualification process needs. Prototype orders start at 5 pieces with a 7–15 business day lead time, so an evaluation unit reaches your lab fast.
Routine production testing
Acceptance criteria are agreed in writing before quotation, and the inspection results ship with the parts:
Leak testing (100% of units) — helium leak test to ≤1×10−9 mbar·L/s or nitrogen pressure-decay, per the agreed criteria.
Proof-pressure testing — to the project requirement, with burst verification on qualification samples.
Flow-resistance check — verified against the rated pressure-drop window at the specified flow rate.
Dimensional and flatness inspection — at the TIM interface, to drawing tolerances.
Bond inspection — diffusion-bonded parts are ultrasonically C-scanned per ASTM E2375; thermal-cycling qualification per IEC 60068-2-14 on qualification samples.
CFD validation before tooling
Before any metal is cut, the design is simulated against your operating point. The CFD model answers the questions that decide whether the plate survives qualification:
Flow distribution — coolant must split evenly across every GPU and switch position; an unbalanced branch shows up as one hot chip at full load.
Pressure drop — the channel network is tuned so the plate stays inside your pump budget at the rated 8.0 LPM flow.
Surface temperature — predicted case temperatures are checked against the <65°C limit before the design is frozen.
The simulation report ships with the DFM review, and the prototype is then verified on the bench: measured ΔP–flow curve and thermal resistance against the CFD prediction, plus helium leak and proof-pressure testing.
Applications
NVIDIA H200 SXM AI training servers and HPC clusters on direct-to-chip liquid cooling. For GB200/GB300 rack-scale platforms or H100 boards, see the related pages below.
NVIDIA H200 Liquid Cold Plate FAQ
What does the H200 cooling set include?
GPU cold plates for the eight 700 W H200 positions plus dedicated switch plates (2 × 186 W and 2 × 186 W positions), brazed in a continuous nitrogen-protection tunnel furnace.
How does the H200 set differ from the H100 board?
The H200 set pairs eight 700 W GPU plates with four dedicated switch plates (4 × 186 W), brazed in a continuous nitrogen-protection tunnel furnace and rated 8 LPM at 18.5 kPa — versus the single-assembly H100 board at 9 LPM / 40 kPa.
What documentation ships with H200 prototype sets?
Dimensional, flow-resistance and seal-test results to the acceptance criteria agreed before quotation, plus the CFD report from the DFM review — the package a server OEM qualification file needs.
What coolant should be used?
Rated performance is tested with Pure water at 38°C inlet. Data-center loops following ASHRAE W55 water quality are supported; alternative mixtures are reviewed during DFM.
What flow rate does it need?
8.0 LPM at 18.5 kPa (±20%) under rated load. Your pump budget and manifold layout are checked against this during engineering review.
Can the design be customized?
Yes. Port locations, hose routing, mounting pattern, and surface finish are customized from your drawings. CFD simulation validates the change before tooling.
What is the MOQ and lead time?
Prototype MOQ is 5 pieces with a 7–15 business day lead time from approved drawing and PO; production runs 4–6 weeks.
How is quality verified before shipment?
Helium leak testing and proof-pressure testing on the production line, plus flatness and dimensional checks to the acceptance criteria agreed in writing before quotation.
Request a quote
Send your drawing, heat map, coolant, and flow budget to info@tonecooling.com or use the quote form — the engineering team returns a manufacturable concept with the quotation. MOQ 5 pcs, prototype in 7–15 business days.
Send drawings for engineering review or download the datasheet (PDF)
Official Platform References
Use these OEM platform pages as reference context only. ToneCooling RFQ review still requires the customer-approved drawing, module envelope, heat load, coolant, flow rate and pressure-drop target.
Related Data Center Cold Plate Engineering Guides
Use these engineering guides to prepare drawings, heat load, coolant, flow rate, pressure-drop target and validation requirements before requesting a data center liquid cold plate quotation.
