The TC-LGA1700-1U1C CPU Cooler is a specialized low-profile cooling solution designed for Intel LGA 1700 socket processors. Engineered to fit into 1U chassis environments, it provides efficient thermal management in compact systems where space, airflow, and reliability are critical. Whether used in enterprise servers or edge computing, the TC-LGA1700-1U1C delivers dependable performance under demanding conditions.
LGA 1700 Compatibility
Supports Intel 12th, 13th, and 14th Gen Core and Xeon processors based on the LGA 1700 socket, ensuring solid performance in modern server and embedded platforms.
Ultra-Low Profile for 1U Servers
Designed specifically for 1U rackmount systems, the cooler features a slim profile that fits within tight space constraints without sacrificing cooling efficiency.
Direct-Contact Copper Base
A high-conductivity copper base ensures rapid heat transfer from the CPU to the heatsink, helping maintain consistent processor performance under load.
High-Speed PWM Blower Fan
Equipped with a high-speed blower fan that delivers focused airflow across the heatsink, the cooler balances thermal performance with noise control in confined environments.
Reliable Mounting and Thermal Interface
Includes a robust mounting system and pre-applied high-efficiency thermal compound for quick, secure installation and optimal thermal conductivity.
Ideal for enterprise or data center deployments, the cooler fits into standard 1U server enclosures, providing consistent thermal control for CPU-intensive operations such as virtualization, cloud hosting, and database management.
Perfect for factory automation, robotics, and machine vision systems, the TC-LGA1700-1U1C offers stable cooling in space-constrained environments that demand reliability and long operational life.
The cooler supports networking hardware such as routers, firewalls, and gateways built on Intel platforms, where thermal performance and system uptime are critical.
For edge servers and AI-enabled IoT gateways operating in remote or constrained locations, the compact design ensures effective heat management without compromising system density.
Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.
✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available
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