ToneCooling 2UM82-CPU-Cooler server rack thermal management

ToneCooling TC-4677-2UM82 CPU Cooler thermal management

TC-4677-2UM82: 2U Air Cooling for LGA4677 Platforms

The TC-4677-2UM82 is a high-performance air cooling solution designed for Intel’s LGA4677 socket, fully compatible with 4th and 5th Gen Xeon Scalable processors (Sapphire Rapids / Emerald Rapids). Engineered specifically for 2U server platforms, it delivers enhanced thermal performance for CPUs with TDP ratings up to 350W, making it ideal for compute-intensive workloads such as AI inference, HPC, cloud computing, and data analytics.

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Core Design Features

A. Performance-Optimized for 2U Systems

Low-profile design with total height under 75mm, ensuring compatibility with standard 2U chassis
Efficient heat dissipation for high-core-count CPUs without performance throttling
Balanced fin density and airflow path for optimal thermal conductivity

B. Full Copper Base with High-Efficiency Heatpipes

Solid copper baseplate (C1100) ensures rapid thermal conduction from CPU IHS
8× Ø6mm sintered copper heatpipes in a dual-array layout for symmetrical heat transfer
Vacuum soldered joints minimize thermal resistance and enhance mechanical reliability

C. Dense Aluminum Fin Stack

Precision-stamped aluminum fins engineered for maximum surface area
Fin geometry optimized for high static pressure airflow
Optional anti-corrosion coating for enhanced durability

TC-4677-1UM71-P Technical

Product model: TC-4677-1UM71-P

CPU type: TC-LGA4677 (rectangular motherboard)

Product size: 118mm*78mm*25.3mm

Power consumption: 185W

Fin thickness: 0.3mm

Fin spacing: 1.5mm

Material: copper base + aluminum fins + 4 heat pipes

Application Scenarios

AI & HPC Environments

Maintains CPU temperatures below critical thresholds during sustained AI workloads
Reliable thermal separation in CPU-GPU co-location deployments

Enterprise Virtualization & Cloud Infrastructure

Supports consistent thermal performance in virtualized multi-tenant cloud nodes
Suitable for cloud-native and containerized workloads

Storage & Data Management Systems

Efficient passive-active cooling hybrid for NVMe-rich and dense storage platforms
Supports airflow-conscious backplane integration

Conclusion: Efficient. Reliable. Scalable.

The TC-4677-2UM82 CPU Cooler is an advanced cooling solution optimized for next-generation Intel Xeon platforms in 2U form factors. With its full copper core, dual-fan design, and high heatpipe density, it ensures powerful and quiet performance even under extreme workloads. Designed with precision engineering and long-term durability in mind, it is the ideal choice for cloud service providers, OEM integrators, and HPC system builders demanding top-tier thermal efficiency and platform stability.

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✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available

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MOQ 5 pcs • Prototype 7-15 days • ISO 9001 Certified

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