Server CPU Liquid Cold Plate | Intel Xeon RFQ Review
Intel LGA7529 Liquid Cold Plate RFQ Review
ToneCooling reviews drawing-based LGA7529 server CPU liquid cold plate projects for direct-to-chip cooling. The RFQ review focuses on socket footprint, keep-out zone, module envelope, coolant path, flow rate, pressure-drop limit, port direction and validation requirements before quotation.
Send the official motherboard or cold plate drawing, heat load, coolant, inlet temperature, target flow rate, allowable pressure drop, hose routing constraint, material preference, prototype quantity and annual demand.
LGA7529 Cold Plate Engineering Data to Confirm
| Target platform | Intel Xeon LGA7529 server CPU liquid cooling projects. Final compatibility depends on the customer-approved mechanical drawing. |
|---|---|
| Cold plate route | Copper or aluminium route is reviewed from heat load, coolant, pressure-drop limit, corrosion risk, weight and cost target. |
| Manufacturing process | CNC machined, vacuum brazed, FSW or other process route is selected after channel geometry and material route review. |
| Required RFQ inputs | Drawing or CAD file, heat-source map, coolant, flow rate, pressure-drop target, envelope, port orientation, quantity and project stage. |
| Validation scope | Leak test, pressure test, flow-resistance check, flatness, cleanliness and documentation requirements are confirmed before quotation. |
| Manufacturing site | Huizhou, Guangdong, China. Regional teams may support communication and project coordination where applicable. |
Engineering Support Pages for LGA7529 RFQs
Use these pages to prepare a cleaner RFQ package before asking for quotation. Each card links to the detailed engineering input page.
Intel LGA7529 RFQ InputsPlatform drawing, heat load, coolant, flow rate and pressure-drop inputs. 
Server CPU Cold Plate RFQ ChecklistDrawing, heat load, coolant, pressure-drop and validation inputs. 
Pressure Drop and Flow Rate ReviewPrepare flow rate, coolant, inlet temperature and pump pressure budget. 
Port Layout and Hose RoutingReview fitting direction, hose clearance, bend radius and service access. 
Leak, Pressure and Cleanliness ValidationDefine leak test, pressure test, cleanliness and documentation scope. 
Server Module Envelope Review1U, 2U and custom chassis envelope, tube route and service access.LGA7529 Cold Plate RFQ Checklist
- Official socket, motherboard or cold plate mechanical drawing
- Heat load, heat-source map and contact area
- Coolant type, inlet temperature and corrosion constraints
- Target flow rate and pressure-drop limit
- Port direction, connector requirement, hose route and bend radius
- Leak, pressure, cleanliness, flatness and documentation requirements
- Prototype quantity, annual demand and project stage
Official Platform Reference
Use Intel Xeon processor information only as platform context. ToneCooling quotation still depends on the customer-approved drawing, thermal requirement and validation scope.
LGA7529 Liquid Cold Plate FAQ
Can ToneCooling manufacture a LGA7529 liquid cold plate from a drawing?
Yes. ToneCooling reviews drawing-based server CPU cold plate projects and confirms manufacturability, channel route, material route, port layout and validation scope before quotation.
Do you guarantee compatibility with every LGA7529 server board?
No unsupported compatibility guarantee is made from the platform name alone. Compatibility must be confirmed from the official mechanical drawing, keep-out zone and mounting envelope.
What information is needed before quotation?
Send drawing or CAD file, heat load, coolant, flow rate, pressure-drop limit, envelope, port orientation, quantity and validation requirements.
Can the port direction and hose layout be customized?
Yes, port direction and hose routing can be reviewed against service access, bend radius, rack layout and pressure-drop budget.
Where are these cold plates manufactured?
Manufacturing is based in Huizhou, Guangdong, China under ToneCooling's manufacturing system.
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